Datasheet > SiSS5110DN

SiSS5110DN

更新时间： 2023-12-06 20:11:59

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威世 - VISHAY		/
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N-Channel 100 V (D-S) MOSFET

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SiSS5110DN 数据手册

SiSS5110DN

Vishay Siliconix

www.vishay.com

N-Channel 100 V (D-S) MOSFET

FEATURES

PowerPAK^®1212-8S

• TrenchFET^®Gen V power MOSFET

• Very low R_DSx Q_gfigure-of-merit (FOM)

• Tuned for the lowest R_DSx Q_ossFOM

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• Primary side switch

• DC/DC converters

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= 10 V

R_DS(on)max. () at V_GS= 7.5 V

Q_gtyp. (nC)

100

0.0126

0.016

9.7

• Power supplies

• Motor drive control

N-Channel MOSFET

I_D(A) ^a

46.3

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8S

SiSS5110DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

100

UNIT

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

46.4

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

13.4 ^{b, c}

10.7 ^{b, c}

100

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

51.6

4.3 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

L = 0.1 mH

E_AS

T_C= 25 °C

56.8

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

36.3

Maximum power dissipation

P_D

4.8 ^{b, c}

3.1 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction to ambient ^b

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction to case (drain)

R_thJC

1.8

2.2

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S22-1016-Rev. A, 12-Dec-2022

Document Number: 62158

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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