SiSS588DN
Vishay Siliconix
www.vishay.com
N-Channel 80 V (D-S) MOSFET
FEATURES
PowerPAK® 1212-8S
D
8
• TrenchFET® Gen V power MOSFET
• Very low RDS x Qg figure-of-merit (FOM)
• Tuned for the lowest RDS x Qoss FOM
• 100 % Rg and UIS tested
D
7
D
6
D
5
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S
2
S
3
S
4
G
1
D
APPLICATIONS
Top View
Bottom View
• Synchronous rectification
• Primary side switch
• DC/DC converters
PRODUCT SUMMARY
VDS (V)
80
G
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 7.5 V
Qg typ. (nC)
0.008
0.0093
14.2
• OR-ing and hot swap switch
• Power supplies
N-Channel MOSFET
• Motor drive control
ID (A)
58.1
S
• Battery management
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Alternate manufacturing location
PowerPAK 1212-8S
SISS588DN-T1-GE3
SISS588DN-T1-BE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
80
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
C = 70 °C
A = 25 °C
TA = 70 °C
58.1
46.5
16.9 b, c
13.5 b, c
150
51.6
4.3 b, c
25
31.25
56.8
36.3
T
T
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
4.8 b, c
3 b, c
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
TYPICAL
21
MAXIMUM
UNIT
t 10 s
Steady state
26
°C/W
Maximum junction-to-case (drain)
RthJC
1.8
2.2
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
g. TC = 25 °C
S23-0900-Rev. B, 30-Oct-2023
Document Number: 63141
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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