Datasheet > SiSS65DN

SiSS65DN

更新时间： 2024-11-25 14:53:55

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	249K
描述
P-Channel 30 V (D-S) MOSFET

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SiSS65DN 数据手册

SiSS65DN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen III p-channel power MOSFET

PowerPAK^®1212-8S

• Industry leadership R_DS(on)specifications

(as of November 2017)

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Adapter and charger switch

• Load switch

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= -10 V

-30

0.0046

0.0075

-94 ^a

Single

• Motor drive control

• DC/DC converter

• Power supplies

_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

_D(A)

Configuration

P-Channel MOSFET

• Battery management

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8S

SiSS65DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-94

-75.2

-25.9 ^{b, c}

-20.7 ^{b, c}

-120

-54.8

-4.2 ^{b, c}

-20

65.8

42.1

5.1 ^{b, c}

3.2 ^{b, c}

-55 to +150

260

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

1.9

°C/W

Maximum junction-to-case (drain)

1.5

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 65 °C/W

S18-0452-Rev. A, 23-Apr-18

Document Number: 76297

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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