Datasheet > SiSS71DN

SiSS71DN

更新时间： 2023-12-06 20:08:26

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	218K
描述
P-Channel 100 V (D-S) MOSFET

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SiSS71DN 数据手册

SiSS71DN

Vishay Siliconix

www.vishay.com

P-Channel 100 V (D-S) MOSFET

FEATURES

• ThunderFET^®power MOSFET

• Low thermal resistance PowerPAK^®package

with small size and low 0.75 mm profile

PRODUCT SUMMARY

V_DS(V)

R_DS(on)() (MAX.)

0.059 at V_GS= -10 V

0.082 at V_GS= -4.5 V

I_D(A) ^e

-23

Q_g(TYP.)

-100

20 nC

-19.6

• 100 % R_gand UIS tested

PowerPAK^®1212-8S

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Active clamp

• DC/DC converters

• POE

• Load switch

• Motor drive control

• Battery management

Top View

Bottom View

Ordering Information: 

SiSS71DN-T1-GE3 (lead (Pb)-free and halogen-free)

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-100

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

_A= 25 °C

-23

-18.5

-6.7 ^{a, b}

-5.4 ^{a, b}

-40

-40 ^e

-4 ^{a, b}

-25

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 70 °C

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

Avalanche Current

I_AS

L = 0.1 mH

Single Pulse Avalanche Energy

E_AS

_C= 25 °C

_C= 70 °C

_A= 25 °C

Maximum Power Dissipation

P_D

4.8 ^{a, b}

3 ^{a, b}

T_A= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak temperature) ^{c, d}

T_J, T_stg

-50 to +150

260

°C

Notes

a. Surface mounted on 1" x 1" FR4 board.

b. t = 10 s.

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

e. T_C= 25 °C.

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{a, b}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

°C/W

Maximum Junction-to-Case (Drain)

Steady state

R_thJC

1.7

2.2

Notes

a. Surface mounted on 1" x 1" FR4 board.

b. Maximum under steady state conditions is 63 °C/W.

S16-1378-Rev. A, 11-Jul-16

Document Number: 76642

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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