Datasheet > SiSS70DN

SiSS70DN

更新时间： 2023-12-06 20:03:57

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	253K
描述
N-Channel 125 V (D-S) MOSFET

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SiSS70DN 数据手册

SiSS70DN

Vishay Siliconix

www.vishay.com

N-Channel 125 V (D-S) MOSFET

FEATURES

• TrenchFET^®with ThunderFET technology

optimizes balance of R_DS(on), Q_g, Q_sw, and Q_oss

PowerPAK^®1212-8S

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Primary side switching

Top View

Bottom View

• Synchronous rectification

• DC/DC converter

• Motor drive control

• Load switch

PRODUCT SUMMARY

V_DS(V)

125

0.0298

_DS(on)max. () at V_GS= 10 V

Q_gtyp. (nC)

_D(A)

Configuration

31 ^a

P-Channel MOSFET

Single

ORDERING INFORMATION

Package

PowerPAK 1212-8S

SiSS70DN-T1-GE3

Lead (Pb)-free and halogen-free

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

125

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

24.8

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

8.5 ^{b, c}

6.8 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

54.8

4.2 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

L = 0.1 mH

E_AS

_C= 25 °C

_C= 70 °C

65.8

42.1

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

5.1 ^{b, c}

3.2 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

1.5

1.9

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 65 °C/W

S18-0494-Rev. A, 07-May-2018

Document Number: 76612

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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