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SiSS40DN PDF预览

SiSS40DN

更新时间: 2024-11-06 14:55:47
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 183K
描述
N-Channel 100 V (D-S) MOSFET

SiSS40DN 数据手册

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SiSS40DN  
Vishay Siliconix  
N-Channel 100 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
ThunderFET® Technology Optimizes Balance  
VDS (V)  
RDS(on) () (Max.)  
0.0210 at VGS = 10 V  
0.0230 at VGS = 7.5 V  
0.0260 at VGS = 6 V  
ID (A)f  
36.5  
35  
Qg (Typ.)  
of RDS(on), Qg, Qsw and Qoss  
100 % Rg and UIS Tested  
Material categorization:  
100  
10 nC  
For definitions of compliance please see  
www.vishay.com/doc?99912  
32  
PowerPAK 1212-8S  
3.3 mm  
APPLICATIONS  
Primary side switch  
Synchronous Rectification  
DC/DC Conversion  
Load Switching  
Boost Converters  
DC/AC Inverters  
D
0.75 mm  
S
S
S
1
G
2
3.3 mm  
3
4
G
D
D
D
6
8
7
D
S
5
BottomView  
N-Channel MOSFET  
Ordering Information:  
SiSS40DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
100  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
36.5  
29  
Continuous Drain Current (TJ = 150 °C)  
ID  
9.7a, b  
7.8a, b  
60  
A
Pulsed Drain Current (t = 300 µs)  
IDM  
IS  
40g  
3.1a, b  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
20  
EAS  
mJ  
W
20  
52  
T
C = 70 °C  
A = 25 °C  
33  
Maximum Power Dissipation  
PD  
3.7a, b  
2.4a, b  
- 55 to 150  
260  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, e  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
RthJA  
RthJC  
33  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 62881  
S13-1668-Rev. A, 29-Jul-13  
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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