SiSS50DN
Vishay Siliconix
www.vishay.com
N-Channel 45 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® 1212-8S
D
8
D
7
D
6
D
5
• Very low RDS(on) in a compact and thermally
enhanced package
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduces
switching related power loss
1
S
• 100 % Rg and UIS tested
2
S
3
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
4
G
1
Top View
Bottom View
D
APPLICATIONS
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
• Synchronous rectification
45
0.00283
0.0041
21.4
108
Single
• Synchronous buck converter
G
• High power density DC/DC
• Battery switching and protection
N-Channel
ID (A)
Configuration
MOSFET
• Load switching
S
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8S
SISS50DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
45
+20 / -16
108
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
86
Continuous drain current (TJ = 150 °C)
ID
29.7 b, c
23.7 b, c
300
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
59.7
4.5 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
30
45
65.7
42
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
5 b, c
3.2 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
20
MAXIMUM
UNIT
t 10 s
Steady state
25
1.9
°C/W
Maximum junction-to-case (drain)
1.5
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 65 °C/W
g. TC = 25 °C
S19-0700-Rev. A, 19-Aug-2019
Document Number: 77149
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000