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SI7606DN-T1-GE3 PDF预览

SI7606DN-T1-GE3

更新时间: 2024-11-21 21:02:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 91K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

SI7606DN-T1-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.83配置:Single
最大漏极电流 (Abs) (ID):14.5 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e3湿度敏感等级:1
最高工作温度:150 °C峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):52 W
子类别:FET General Purpose Powers表面贴装:YES
端子面层:PURE MATTE TIN处于峰值回流温度下的最长时间:30
Base Number Matches:1

SI7606DN-T1-GE3 数据手册

 浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第2页浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第3页浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第4页浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第5页浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第6页浏览型号SI7606DN-T1-GE3的Datasheet PDF文件第7页 
Si7606DN  
Vishay Siliconix  
N-Channel 125-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
I
D (A)a  
14.5  
14  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
Available  
0.108 at VGS = 10 V  
0.115 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
125  
9.1 nC  
Optimized for Fast Switching Applications  
Low Thermal Resistance PowerPAK® Package  
with Small Size and Low 1.07 mm Profile  
100 % Rg Tested  
PowerPAK® 1212-8  
S
3.30 mm  
3.30 mm  
D
1
APPLICATIONS  
Primary Side Switch  
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
S
Ordering Information: Si7606DN-T1-E3 (Lead (Pb)-free)  
Si7606DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
125  
20  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
14.5  
11.6  
3.9b, c  
3.1b, c  
20  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
18  
3.2b, c  
15  
Continuous Source-Drain Diode Current  
IAS  
Avalanche Current  
L = 0.1 mH  
EAS  
Single-Pulse Avalanche Energy  
mJ  
W
11  
52  
33  
3.8b, c  
2.4b, c  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
PD  
Maximum Power Dissipation  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
26  
Maximum  
Unit  
t 10 s  
33  
°C/W  
Steady State  
RthJC  
1.9  
2.4  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 81 °C/W.  
Document Number: 73429  
S-83050-Rev. B, 29-Dec-08  
www.vishay.com  
1

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