Si7621DN
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) (Ω)
ID (A)
Qg (Typ.)
Definition
- 4c
- 4c
0.090 at VGS = - 4.5 V
0.180 at VGS = - 2.5 V
•
•
TrenchFET® Power MOSFET: 2.5 V Rated
PowerPAK® Package
- 20
3.8 nC
- Low Thermal Resistance
- Low 1.07 mm Profile
•
•
100 Rg Tested
Compliant to RoHS Directive 2002/95/EC
PowerPAK 1212-8
APPLICATIONS
•
•
Load Switching
HDD
S
S
3.30 mm
3.30 mm
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
D
Bottom View
Ordering Information: Si7621DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
Unit
VDS
Drain-Source Voltage
Gate-Source Voltage
- 20
12
V
VGS
- 4c
- 4c
- 4a, b, c
TC = 25 °C
C = 70 °C
T
Continuous Drain Current (TJ = 150 °C)a, b
ID
TA = 25 °C
TA = 70 °C
- 3.8a, b
A
IDM
IS
Pulsed Drain Current
- 15
- 4c
TC = 25 °C
TA = 25 °C
TC = 25 °C
Continuous Source-Drain Diode Currenta, b
- 2.6a, b
12.5
8
T
C = 70 °C
A = 25 °C
Maximum Power Dissipationa, b
PD
W
3.1a, b
T
2a, b
- 55 to 150
260
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Package limited.
d. See Solder Profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 65544
S09-2272-Rev. A, 02-Nov-09
www.vishay.com
1