Si7615CDN
Vishay Siliconix
www.vishay.com
P-Channel 20 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen III p-channel power MOSFET
PowerPAK® 1212-8 Single
D
D
7
8
D
6
• RDS(on) rating at VGS = -1.8 V
D
5
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
1
2
S
S
3
S
APPLICATIONS
S
4
G
1
• Battery management in mobile devices
• Battery switch
Top View
Bottom View
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = -4.5 V
G
• Load switch
-20
0.0090
0.0100
0.0117
0.0203
42
R
R
DS(on) max. () at VGS = -3.7 V
DS(on) max. () at VGS = -2.5 V
RDS(on) max. () at VGS = -1.8 V
D
Qg typ. (nC)
P-Channel MOSFET
I
D (A) a, g
-35
Configuration
Single
ORDERING INFORMATION
Package
PowerPAK 1212-8
Si7615CDN-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
8
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
-35 a
-35 a
-16.3 b, c
-13 b, c
-80
-27.4
-3 b, c
-20
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
20
33
21.1
mJ
W
TC = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
3.6 b, c
2.3 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
28
MAXIMUM
UNIT
t 10 s
Steady state
36
3.8
°C/W
2.9
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
g. TC = 25 °C.
S16-1778-Rev. A, 05-Sep-16
Document Number: 77771
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000