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SI7617DN_15 PDF预览

SI7617DN_15

更新时间: 2024-11-22 01:24:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
14页 611K
描述
P-Channel 30-V (D-S) MOSFET

SI7617DN_15 数据手册

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Si7617DN  
Vishay Siliconix  
www.vishay.com  
P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
• TrenchFET® power MOSFET  
• 100 % Rg and UIS tested  
• Material categorization:  
VDS (V)  
RDS(on) (Ω)  
ID (A) d, g  
-35  
Qg (TYP.)  
0.0123 at VGS = -10 V  
0.0222 at VGS = -4.5 V  
-30  
20.5 nC  
-35  
for definitions of compliance please see  
www.vishay.com/doc?99912  
PowerPAK® 1212-8 Single  
D
D
7
8
D
6
APPLICATIONS  
S
D
5
• Notebook battery charging  
• Notebook adapter switch  
G
1
S
2
S
3
S
4
G
1
Top View  
Bottom View  
D
P-Channel MOSFET  
Ordering Information:  
Si7617DN-T1-GE3 (Lead (Pb)-free and halogen-free)  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-30  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
25  
T
T
C = 25 °C  
C = 70 °C  
-35 d  
-35 d  
-13.9 a, b  
-11.1 a, b  
-60  
-35 d  
-3 a, b  
-29  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed Drain Current  
IDM  
IS  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
Avalanche Current  
IAS  
L = 0.1 mH  
Single-Pulse Avalanche Energy  
EAS  
42  
mJ  
W
T
T
C = 25 °C  
C = 70 °C  
52  
33  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
3.7 a, b  
2.4 a, b  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) e, f  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient a, c  
SYMBOL  
TYPICAL  
26  
MAXIMUM  
UNIT  
t 10 s  
Steady State  
RthJA  
RthJC  
33  
°C/W  
Maximum Junction-to-Case  
1.9  
2.4  
Notes  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. Maximum under steady state conditions is 81 °C/W.  
d. Package limited.  
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
g. Based on TC = 25 °C.  
S15-1032-Rev. B, 04-May-15  
Document Number: 65164  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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