Datasheet > Si7619DN

Si7619DN

更新时间： 2024-11-26 14:55:47

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	591K
描述
P-Channel 30 V (D-S) MOSFET

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Si7619DN 数据手册

Si7619DN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

PowerPAK^®1212-8 Single

• TrenchFET^®power MOSFET

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Notebook PC

- Load switch

Top View

Bottom View

- Battery switch

- Adaptor switch

PRODUCT SUMMARY

V_DS(V)

-30

0.021

0.034

_DS(on)max. () at V_GS= -10 V

_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

I_D(A) ^{d, e}

P-Channel MOSFET

-24

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8

Si7619DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

-30

-24 ^e

-23.8

-10.5 ^{a, b}

-8.3 ^{a, b}

-50

-23.2

-2.9 ^{a, b}

-20

_C= 25 °C

_C= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed drain current

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

Continuous source-drain diode current

Avalanche current

Single-pulse avalanche energy

I_AS

E_AS

L = 0.1 mH

27.8

17.8

_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

3.5 ^{a, b}

2.2 ^{a, b}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{f, g}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{a, c}

Maximum junction-to-case

SYMBOL

TYPICAL

MAXIMUM

UNIT

°C/W

t  10 s

Steady state

R_thJA

R_thJC

4.5

3.6

Notes

a. Surface mounted on 1" x 1" FR4 board

b. t = 10 s

c. Maximum under steady state conditions is 81 °C/W

d. Based on T_C= 25 °C

e. Package limited

f. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

g. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

S09-2269-Rev. A, 02-Nov-09

Document Number: 65533

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...13

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