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SI7655DN

更新时间： 2024-11-21 12:00:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 221K
描述
P-Channel 20 V (D-S) MOSFET

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SI7655DN 数据手册

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New Product  
Si7655DN  
Vishay Siliconix  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
TrenchFET® Power MOSFET  
Low Thermal Resistance PowerPAK®  
VDS (V)  
RDS(on) () Max.  
ID (A)  
Qg (Typ.)  
•
Package with Small Size and Low 0.75 mm  
Profile  
100 % Rg and UIS Tested  
Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
- 40e  
- 40e  
- 40e  
0.0036 at VGS = - 10 V  
0.0048 at VGS = - 4.5 V  
0.0085 at VGS = - 2.5 V  
- 20  
72 nC  
•
•
PowerPAK 1212-8S  
APPLICATIONS  
3.3 mm  
•
Smart Phones, Tablet PCs, Mobile  
Computing  
0.75 mm  
S
S
S
- Battery Switch  
- Load Switch  
S
1
G
4
2
3.3 mm  
3
G
D
D
D
6
8
7
D
5
BottomView  
D
Ordering Information:  
Si7655DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
- 20  
12  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
- 40e  
- 40e  
- 31a, b  
- 25a, b  
- 100  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
ID  
Continuous Drain Current (TJ = 150 °C)  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
- 40e  
- 4a, b  
- 20  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Avalanche Current  
L = 0.1 mH  
EAS  
20  
57  
36  
4.8a, b  
3a, b  
mJ  
W
Single-Pulse Avalanche Energy  
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
PD  
Maximum Power Dissipation  
T
TJ, Tstg  
- 50 to 150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Package limited.  
Document Number: 63617  
S12-2393-Rev. B, 15-Oct-12  
www.vishay.com  
1
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
12345678

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