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SI7634BDP-T1-E3 PDF预览

SI7634BDP-T1-E3

更新时间: 2024-11-25 09:25:47
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 478K
描述
N-Channel 30-V (D-S) MOSFET

SI7634BDP-T1-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT
包装说明:SMALL OUTLINE, R-XDSO-C5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.19雪崩能效等级(Eas):45 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):40 A
最大漏极电流 (ID):22.5 A最大漏源导通电阻:0.0054 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XDSO-C5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):48 W
最大脉冲漏极电流 (IDM):70 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管元件材料:SILICONBase Number Matches:1

SI7634BDP-T1-E3 数据手册

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New Product  
Si7634BDP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free available  
TrenchFET® Power MOSFET  
100 % Rg Tested  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
RoHS  
40g  
40g  
0.0054 at VGS = 10 V  
0.007 at VGS = 4.5 V  
COMPLIANT  
30  
21.5 nC  
100 % Avalanche Tested  
PowerPAK SO-8  
APPLICATIONS  
Notebook PC Core  
- Low Side  
- High Side  
S
6.15 mm  
5.15 mm  
1
D
S
2
S
3
G
4
D
8
D
7
G
D
6
D
5
Bottom View  
S
Ordering Information: Si7634BDP-T1-E3 (Lead (Pb)-free)  
Si7634BDP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
40g  
40g  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
22.5b, c  
TA = 25 °C  
TA = 70 °C  
18.0b, c  
70  
40g  
4.5b, c  
30  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
EAS  
45  
48  
31  
5.0b, c  
3.2b, c  
mJ  
W
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
PD  
Maximum Power Dissipation  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
20  
25  
°C/W  
RthJC  
Steady State  
2.1  
2.6  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed cop-  
per (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is  
not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 65 °C/W.  
g. Package Limited.  
Document Number: 74031  
S-80439-Rev. C, 03-Mar-08  
www.vishay.com  
1

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