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Si7615ADN PDF预览

Si7615ADN

更新时间: 2024-11-22 14:54:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 595K
描述
P-Channel 20-V (D-S) MOSFET

Si7615ADN 数据手册

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Si7615ADN  
Vishay Siliconix  
www.vishay.com  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen III p-channel power MOSFET  
PowerPAK® 1212-8 Single  
D
D
7
8
D
6
• 100 % Rg and UIS tested  
D
5
• Material categorization:  
For definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
S
APPLICATIONS  
3
S
S
4
G
1
• Adaptor switch  
• Battery switch  
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
• Load switch  
-20  
0.0044  
0.0060  
0.0098  
59  
RDS(on) max. () at VGS = -10 V  
RDS(on) max. () at VGS = -4.5 V  
RDS(on) max. () at VGS = -2.5 V  
Qg typ. (nC)  
D
ID (A) a  
-35  
P-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
PowerPAK 1212-8  
Si7615ADN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
VDS  
LIMIT  
-20  
UNIT  
Drain-source voltage  
Gate-source voltage  
V
VGS  
12  
-35 a  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
a
-35  
Continuous drain current (TJ = 150 °C)  
ID  
-22.1 b, c  
-17.6 b, c  
-80  
A
Pulsed drain current (t = 300 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
-35 a  
-3.3 b, c  
Continuous source-drain diode current  
Avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
-20  
20  
L = 0.1 mH  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
52  
33  
Maximum power dissipation  
PD  
3.7 b, c  
2.4 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
26  
1.9  
33  
2.4  
°C/W  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 81 °C/W  
S12-2733-Rev. B, 12-Nov-12  
Document Number: 62667  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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