New Product
Si7611DN
Vishay Siliconix
P-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
•
•
Halogen-free
VDS (V)
RDS(on) (Ω)
ID (A)
Qg (Typ.)
TrenchFET® Power MOSFET
- 18e
- 18e
Low Thermal Resistance PowerPAK®
Package with Small Size and Low 1.07 mm
Profile
0.025 at VGS = - 10 V
0.033 at VGS = - 4.5V
RoHS
- 40
41 nC
COMPLIANT
•
100 % Rg and UIS Tested
APPLICATIONS
Load Switch
•
PowerPAK 1212-8
S
3.30 mm
3.30 mm
S
1
S
2
S
3
G
4
D
G
8
D
7
D
6
D
5
Bottom View
D
P-Channel MOSFET
Ordering Information: Si7611DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
Unit
VDS
Drain-Source Voltage
Gate-Source Voltage
- 40
V
VGS
20
- 18e
- 18e
- 9.3a, b
- 7.4a, b
- 20
- 18e
- 3a, b
- 23
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
ID
A
IDM
IS
Pulsed Drain Current
TC = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
IAS
Avalanche Current
L = 0.1 mH
EAS
Single-Pulse Avalanche Energy
26
mJ
W
T
T
T
C = 25 °C
C = 70 °C
A = 25 °C
39
25
PD
Maximum Power Dissipation
3.7a, b
2.4a, b
- 50 to 150
260
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)c, d
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 69939
S-80895-Rev. B, 21-Apr-08
www.vishay.com
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