Si7454FDP
Vishay Siliconix
www.vishay.com
N-Channel 100 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
• TrenchFET® Gen IV power MOSFET
• Very low RDS x Qg figure-of-merit (FOM)
• Tuned for the lowest RDS x Qoss FOM
• 100 % Rg and UIS tested
D
D
7
8
D
6
D
5
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S
2
3
S
4
G
S
1
APPLICATIONS
D
Top View
Bottom View
• Synchronous rectification
• Primary side switch
PRODUCT SUMMARY
• DC/DC converters
VDS (V)
R
R
100
0.0295
0.034
8
23.5
Single
G
• Power supplies
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
• Motor drive control
Qg typ. (nC)
D (A)
Configuration
S
I
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
Si7454FDP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
100
20
UNIT
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
23.5
18.8
7.2 b, c
5.7 b, c
40
35.5
3.3 b, c
15
11.25
39
25
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
3.6 b, c
2.3 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
24
MAXIMUM
UNIT
Maximum junction-to-ambient b
t 10 s
Steady state
34
3.2
°C/W
Maximum junction-to-case (drain)
2.5
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
g. TC = 25 °C
S20-0882-Rev. A, 16-Nov-2020
Document Number: 79350
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000