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SI7456DP-T1-E3 PDF预览

SI7456DP-T1-E3

更新时间: 2024-11-02 12:46:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 145K
描述
N-Channel 100-V (D-S) MOSFET

SI7456DP-T1-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:SOT
包装说明:SMALL OUTLINE, R-PDSO-F5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:7.15其他特性:AVALANCHE RATED
雪崩能效等级(Eas):45 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):5.7 A最大漏极电流 (ID):5.7 A
最大漏源导通电阻:0.025 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
功耗环境最大值:1.9 W最大功率耗散 (Abs):1.9 W
最大脉冲漏极电流 (IDM):40 A认证状态:Not Qualified
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:FLAT端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):140 ns最大开启时间(吨):60 ns

SI7456DP-T1-E3 数据手册

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Si7456DP  
Vishay Siliconix  
N-Channel 100-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
9.3  
Available  
TrenchFET® Power MOSFETs  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
0.025 at VGS = 10 V  
0.028 at VGS = 6.0 V  
100  
8.8  
PWM Optimized for Fast Switching  
100 % Rg Tested  
PowerPAK SO-8  
APPLICATIONS  
Primary Side Switch for High Density DC/DC  
Telecom/Server 48 V, Full-/Half-Bridge DC/DC  
Industrial and 42 V Automotive  
D
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
8
D
7
D
6
G
D
5
Bottom View  
Ordering Information: Si7456DP-T1-E3 (Lead (Pb)-free)  
Si7456DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
100  
20  
V
VGS  
TA = 25 °C  
TA = 85 °C  
9.3  
6.7  
5.7  
4.1  
Continuous Drain Current (TJ = 150°C)a  
ID  
A
IDM  
IAS  
EAS  
IS  
Pulsed Drain Current  
40  
30  
45  
Avalanche Current  
L = 0.1 mH  
Single Avalanche Energy (Duty Cycle 1 %)  
Continuous Source Current (Diode Conduction)a  
mJ  
A
4.3  
5.2  
2.7  
1.6  
1.9  
1.0  
TA = 25 °C  
TA = 85 °C  
Maximum Power Dissipationa  
PD  
W
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b,c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
19  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
24  
65  
Maximum Junction-to-Ambienta  
Maximum Junction-to-Case  
RthJA  
52  
°C/W  
RthJC  
1.5  
1.8  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71603  
S09-0271-Rev. F, 16-Feb-09  
www.vishay.com  
1

SI7456DP-T1-E3 替代型号

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