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SI7465DP_13 PDF预览

SI7465DP_13

更新时间: 2024-02-23 03:22:44
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 150K
描述
P-Channel 60-V (D-S) MOSFET

SI7465DP_13 数据手册

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Si7465DP  
Vishay Siliconix  
P-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 5  
Qg (Typ.)  
Available  
TrenchFET® Power MOSFET  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
0.064 at VGS = - 10 V  
0.080 at VGS = - 4.5 V  
- 60  
26  
- 4.5  
PowerPAK SO-8  
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
S
4
D
8
D
G
7
D
6
D
5
Bottom View  
D
Ordering Information:  
Si7465DP-T1-E3 (Lead (Pb)-free)  
Si7465DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
- 60  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
TA = 25 °C  
TA = 70 °C  
- 5  
- 4  
- 3.2  
- 2.6  
Continuous Drain Current (TJ = 150°C)a  
ID  
IDM  
IS  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
Avalanche Current  
- 25  
A
- 2.9  
- 1.2  
IAS  
EAS  
22  
L = 0.1 mH  
Single Pulse Avalanche Energy  
24.2  
mJ  
W
TA = 25 °C  
TA = 70 °C  
3.5  
2.2  
1.5  
Maximum Power Dissipationa  
PD  
0.94  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b,c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
27  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
36  
85  
Maximum Junction-to-Ambienta  
RthJA  
60  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
3.3  
4.3  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73113  
S09-0271-Rev. C, 16-Feb-09  
www.vishay.com  
1

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