Si7469ADP
Vishay Siliconix
www.vishay.com
P-Channel 80 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV p-channel power MOSFET
PowerPAK® SO-8 Single
D
D
7
8
• Very low RDS(on) minimizes voltage drop and
reduces conduction loss
D
6
D
5
• Eliminates the need for charge pump
• 100 % Rg and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
S
3
4
G
S
1
S
APPLICATIONS
Top View
Bottom View
• Adapter and charger switch
• Battery and circuit protection
PRODUCT SUMMARY
VDS (V)
G
-80
0.0193
0.027
19.3
• OR-ing
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -4.5 V
Qg typ. (nC)
• Load switch
• Motor drive control
ID (A)
-46
D
Configuration
Single
P-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
Si7469ADP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
-80
+20 / -20
-46
UNIT
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
-36.8
-7.4 b, c
-5.9 b, c
-125
-66.8
-4.5 b, c
-40
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
-80
73.5
mJ
W
TC = 70 °C
47
5 b, c
3.2 b, c
-55 to +150
260
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
TYPICAL
20
MAXIMUM
UNIT
t 10 s
Steady state
25
°C/W
Maximum junction-to-case (drain)
RthJC
1.35
1.7
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 65 °C/W
g. TC = 25 °C
S20-0735-Rev. A, 28-Sep-2020
Document Number: 66831
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000