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SI7456CDP

更新时间: 2024-11-03 01:10:55
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威世 - VISHAY /
页数 文件大小 规格书
7页 132K
描述
N-Channel 100 V (D-S) MOSFET

SI7456CDP 数据手册

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New Product  
Si7456CDP  
Vishay Siliconix  
N-Channel 100 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
27.5  
27  
Definition  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
0.0235 at VGS = 10 V  
0.0245 at VGS = 7.5 V  
0.0315 at VGS = 4.5 V  
100  
7.7 nC  
24  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK® SO-8  
APPLICATIONS  
DC/DC Primary Side Switch  
Telecom/Server 48 V, Full/Half-Bridge dc-to-dc  
Industrial  
S
6.15 mm  
5.15 mm  
1
S
D
2
S
3
G
4
D
8
D
7
G
D
6
D
5
Bottom View  
Ordering Information: Si7456CDP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
Limit  
100  
20  
Unit  
V
VGS  
TC = 25 °C  
27.5  
22  
10.3b, c  
8.2b, c  
50  
T
C = 70 °C  
A = 25 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
T
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
T
C = 25 °C  
A = 25 °C  
25  
4.5b, c  
Continuous Source-Drain Diode Current  
T
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
15  
L = 0.1 mH  
TC = 25 °C  
EAS  
mJ  
W
11.2  
35.7  
22.8  
5.0b, c  
3.2b, c  
TC = 70 °C  
PD  
Maximum Power Dissipation  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
RthJA  
t 10 s  
20  
25  
°C/W  
Steady State  
RthJC  
2.9  
3.5  
Notes:  
a. Based on TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 70 °C/W.  
Document Number: 65941  
S10-0785-Rev. A, 05-Apr-10  
www.vishay.com  
1

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