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SI7454DP-T1-GE3 PDF预览

SI7454DP-T1-GE3

更新时间: 2024-11-02 12:46:59
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
7页 166K
描述
N-Channel 100-V (D-S) MOSFET

SI7454DP-T1-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:SOT
包装说明:SMALL OUTLINE, R-XDSO-C5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.16Is Samacsys:N
雪崩能效等级(Eas):31 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):5 A最大漏极电流 (ID):5 A
最大漏源导通电阻:0.034 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XDSO-C5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):4.8 W最大脉冲漏极电流 (IDM):30 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI7454DP-T1-GE3 数据手册

 浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第2页浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第3页浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第4页浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第5页浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第6页浏览型号SI7454DP-T1-GE3的Datasheet PDF文件第7页 
Si7454DP  
Vishay Siliconix  
N-Channel 100-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
7.8  
Available  
0.034 at VGS = 10 V  
0.040 at VGS = 6.0 V  
TrenchFET® Power MOSFETs  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
100  
7.2  
PWM Optimized for Fast Switching  
100 % Rg Tested  
PowerPAK® SO-8  
APPLICATIONS  
Primary Side Switch for High Density DC/DC  
Telecom/Server 48 V, Full-/Half-Bridge DC/DC  
Industrial and 42 V Automotive  
D
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
8
D
7
D
6
G
D
5
Bottom View  
S
Ordering Information: Si7454DP-T1-E3 (Lead (Pb)-free)  
Si7454DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
100  
20  
V
TA = 25 °C  
TA = 85 °C  
7.8  
5.7  
5.0  
3.6  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IAS  
EAS  
IS  
Pulsed Drain Current  
30  
Avalanche Current  
25  
31  
L = 0.1 mH  
TA = 25 °C  
Single Avalanche Energy (Duty Cycle 1 %)  
Continuous Source Current (Diode Conduction)a  
mJ  
A
4.0  
4.8  
2.6  
1.6  
1.9  
1.0  
Maximum Power Dissipationa  
PD  
W
TA = 85 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
21  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
26  
65  
2
Maximum Junction-to-Ambienta  
RthJA  
55  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
1.6  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71618  
S09-0227-Rev. D, 09-Feb-09  
www.vishay.com  
1

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