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SI5915BDC PDF预览

SI5915BDC

更新时间: 2024-09-15 06:11:35
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威世 - VISHAY /
页数 文件大小 规格书
7页 116K
描述
Dual P-Channel 8-V (D-S) MOSFET

SI5915BDC 数据手册

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New Product  
Si5915BDC  
Vishay Siliconix  
Dual P-Channel 8-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
Low Thermal Resistance  
VDS (V)  
rDS(on) (Ω)  
ID (A)  
Qg (Typ)  
4a  
4a  
40 % Smaller Footprint than TSOP-6  
0.070 at VGS = - 4.5 V  
0.086 at VGS = - 2.5 V  
0.145 at VGS = - 1.8 V  
RoHS  
COMPLIANT  
APPLICATIONS  
- 8  
5 nC  
Load Switch or Battery Switch for Portable Devices  
3.6  
1206-8 ChipFET® (Dual)  
1
S
1
S
2
S
1
D
G
1
1
D
S
1
2
Marking Code  
G
1
G
2
D
G
2
DG XXX  
2
Lot Traceability  
and Date Code  
D
2
Part #  
Code  
D
1
D
2
Bottom View  
Ordering Information: Si5915BDC-T1-E3 (Lead (Pb)-free)  
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
- 8  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
8
T
C = 25 °C  
- 4a  
- 4a  
- 4a, b, c  
- 3.2b, c  
- 10  
- 4a  
- 1.9b, c  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TC = 25 °C  
3.1  
T
C = 70 °C  
A = 25 °C  
2
PD  
Maximum Power Dissipation  
W
1.7b, c  
1.1b, c  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Foot (Drain)  
Symbol  
RthJA  
Typical  
62  
Maximum  
Unit  
t 5 sec  
74  
40  
°C/W  
RthJF  
33  
Steady State  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 Board.  
c. t = 5 sec.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The 1206-8 ChipFET is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is  
not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 120 °C/W.  
Document Number: 70484  
S-71325–Rev. A, 02-Jul-07  
www.vishay.com  
1

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