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SI5935CDC-T1-E3 PDF预览

SI5935CDC-T1-E3

更新时间: 2024-11-06 06:11:35
品牌 Logo 应用领域
威世 - VISHAY 晶体小信号场效应晶体管开关
页数 文件大小 规格书
7页 113K
描述
Dual P-Channel 20-V (D-S) MOSFET

SI5935CDC-T1-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-XDSO-C8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.2
Is Samacsys:N配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):4 A
最大漏极电流 (ID):4 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XDSO-C8
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):3.1 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:PURE MATTE TIN
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI5935CDC-T1-E3 数据手册

 浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第2页浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第3页浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第4页浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第5页浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第6页浏览型号SI5935CDC-T1-E3的Datasheet PDF文件第7页 
Si5935CDC  
Vishay Siliconix  
Dual P-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFETs  
100 % Rg Tested  
I
D (A)a  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
- 4g  
- 4g  
0.100 at VGS = - 4.5 V  
0.120 at VGS = - 2.5 V  
0.156 at VGS = - 1.8 V  
RoHS  
COMPLIANT  
APPLICATIONS  
- 20  
6.2 nC  
Load Switch for Portable Devices  
- 3.8  
Battery Switch  
1206-8 Chip-FET®  
1
S
1
S
2
S
1
D
1
G
1
Marking Code  
DK XXX  
D
1
S
2
G
1
G
2
Lot Traceability  
and Date Code  
D
2
G
2
D
2
Part # Code  
Bottom View  
Ordering Information: Si5935CDC-T1-E3 (Lead (Pb)-free)  
D
D
2
1
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
VDS  
Limit  
- 20  
8
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
- 4g  
- 3.8  
- 3.1b, c  
TC = 25 °C  
TC = 70 °C  
ID  
Continuous Drain Current (TJ = 150 °C)  
T
A = 25 °C  
- 2.5b, c  
- 10  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
- 2.6  
- 1.7b, c  
3.1  
Source Drain Current Diode Current  
2.0  
PD  
Maximum Power Dissipation  
W
1.3b, c  
0.8b, c  
TJ, Tstg  
- 55 to 150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJF  
Typ.  
77  
Max.  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Foot (Drain)  
Notes:  
t 5 s  
95  
40  
°C/W  
Steady State  
33  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequade bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 130 °C/W.  
g. Package limited.  
Document Number: 68965  
S-82573-Rev. A, 27-Oct-08  
www.vishay.com  
1

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