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SI5938DU

更新时间: 2024-11-06 06:11:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 127K
描述
Dual N-Channel 20-V (D-S) MOSFET

SI5938DU 数据手册

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Si5938DU  
Vishay Siliconix  
Dual N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
ChipFET® Package  
0.039 at VGS = 4.5 V  
0.045 at VGS = 2.5 V  
0.055 at VGS = 1.8 V  
6
6
6
RoHS  
20  
6 nC  
COMPLIANT  
- Small Footprint Area  
- Low On-Resistance  
PowerPAK ChipFET Dual  
- Thin 0.8 mm Profile  
APPLICATIONS  
1
Load Switch for Portable Applications  
DC-DC Point-of-Load  
Marking Code  
CA XXX  
2
S
1
D
1
D
2
G
1
3
Lot Traceability  
and Date Code  
D
1
4
S
8
2
D
1
Part # Code  
G
7
2
D
2
G
1
G
2
6
D
2
5
S
S
2
1
Bottom View  
Ordering Information: Si5938DU-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
20  
Unit  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
V
8
6a  
6a  
T
C = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
7.2b, c  
TA = 25 °C  
TA = 70 °C  
5.8b, c  
20  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
6.9  
1.9b, c  
8.3  
Continuous Source-Drain Diode Current  
T
C = 25 °C  
C = 70 °C  
T
5.3  
PD  
Maximum Power Dissipation  
W
2.3b, c  
1.5b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
45  
Maximum  
Unit  
t 5 s  
Steady State  
55  
15  
°C/W  
12  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 105 °C/W.  
Document Number: 73463  
S-81449-Rev. B, 23-Jun-08  
www.vishay.com  
1

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