Datasheet > Si5948DU

Si5948DU

更新时间： 2024-11-07 14:53:43

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	386K
描述
Dual N-Channel 40 V (D-S) MOSFET

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Si5948DU 数据手册

Si5948DU

Vishay Siliconix

www.vishay.com

Dual N-Channel 40 V (D-S) MOSFET

FEATURES

• TrenchFET^®power MOSFET

PRODUCT SUMMARY

V_DS(V)

R_DS(on)() MAX.

0.082 at V_GS= 10 V

0.094 at V_GS= 4.5 V

I_D(A)

6 ^a

Q_g(TYP.)

• 100 % R_gand UIS tested

2.2 nC

• New thermally enhanced PowerPAK^®

ChipFET^®package

- Small footprint area

- Low on-resistance

- Thin 0.8 mm profile

PowerPAK^®ChipFET^®Dual

D₁

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

D₁

D₂

APPLICATIONS

• DC/DC power supply

S₁

G₁

₂

G₂

Top View

Bottom View

Marking Code: CG

Ordering Information:

Si5948DU-T1-GE3 (lead (Pb)-free and halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-Source Voltage

Gate-Source Voltage

SYMBOL

V_DS

LIMIT

UNIT

V_GS

T_C= 25 °C

6 ^a

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

5.5

Continuous Drain Current (T_J= 150 °C)

I_D

3.7 ^{b, c}

2.9 ^{b, c}

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

5.8

1.7 ^{b, c}

Continuous Source-Drain Diode Current

T_A= 25 °C

Single Pulse Avalanche Current

Avalanche Energy

I_AS

L = 0.1 mH

E_AS

1.8

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

4.4

Maximum Power Dissipation

P_D

2 ^{b, c}

1.3 ^{b, c}

-55 to +150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{b, f}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  5 s

Steady State

°C/W

Maximum Junction-to-Case (Drain)

R_thJC

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 105 °C/W.

S16-1127-Rev. A, 06-Jun-16

Document Number: 76424

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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