Si5936DU
Vishay Siliconix
www.vishay.com
Dual N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® power MOSFET
PowerPAK® ChipFET® Dual
D1
• Thermally enhanced PowerPAK® ChipFET®
package
- Small footprint area
- Low on-resistance
- Thin 0.8 mm profile
• 100 % Rg tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D1
7
8
D2
6
D2
5
1
S1
2
G1
3
4
G2
1
Top View
Bottom View
APPLICATIONS
• Network
Marking code: CF
• System power DC/DC
PRODUCT SUMMARY
D
1
D
2
VDS (V)
30
0.030
0.040
3.5
R
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
R
G
1
G
2
Qg typ. (nC)
D (A) a
Configuration
I
6
S
1
S
2
Dual
N-Channel MOSFET
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK ChipFET
Si5936DU-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
30
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
20
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
6 a
6 a
Continuous drain current (TJ = 150 °C)
ID
6 a, b, c
5.3 b, c
25
A
Pulsed drain current (t = 300 μs)
IDM
IS
TC = 25 °C
6 a
1.9 b, c
10.4
Continuous source-drain diode current
TA = 25 °C
TC = 25 °C
T
C = 70 °C
6.7
Maximum power dissipation
PD
W
TA = 25 °C
TA = 70 °C
2.3 b, c
1.5 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
TYPICAL
43
MAXIMUM
UNIT
t 5 s
Steady state
RthJA
RthJC
55
12
°C/W
9.5
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 5 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 105 °C/W
S12-2729-Rev. A, 12-Nov-12
Document Number: 62804
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000