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SI5935DC-T1-E3 PDF预览

SI5935DC-T1-E3

更新时间: 2024-11-06 12:56:43
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页数 文件大小 规格书
10页 228K
描述
MOSFET 2P-CH 20V 3A 1206-8

SI5935DC-T1-E3 数据手册

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Si5935DC  
Vishay Siliconix  
Dual P-Channel 1.8 V (G-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 4.1  
- 3.4  
- 2.9  
Definition  
0.086 at VGS = - 4.5 V  
0.121 at VGS = - 2.5 V  
0.171 at VGS = - 1.8 V  
TrenchFET® Power MOSFETs  
Low RDS(on) Dual and Excellent Power  
Handling in a Compact Footprint  
Compliant to RoHS Directive 2002/95/EC  
- 20  
1206-8 ChipFET®  
APPLICATIONS  
Load Switch  
PA Switch  
Battery Switch  
1
S
1
S
1
S
2
Marking Code  
D
1
G
1
DF XX  
D
1
S
2
Lot Traceability  
and Date Code  
D
2
G
2
G
G
2
1
Part # Code  
D
2
Bottom View  
D
1
D
2
Ordering Information: Si5935DC-T1-E3 (Lead (Pb)-free)  
Si5935DC-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
5 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 20  
8
V
VGS  
TA = 25 °C  
TA = 85 °C  
- 4.1  
- 2.9  
- 3  
Continuous Drain Current (TJ = 150 °C)a  
ID  
- 2.2  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
IDM  
IS  
- 15  
- 1.8  
2.1  
- 0.9  
1.1  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 85 °C  
1.1  
0.6  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typical  
50  
Maximum  
Unit  
t 5 s  
60  
110  
40  
Maximum Junction-to-Ambienta  
Steady State  
Steady State  
90  
°C/W  
RthJF  
Maximum Junction-to-Foot (Drain)  
30  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72220  
S10-0936-Rev. C, 19-Apr-10  
www.vishay.com  
1

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