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SI5933CDC-T1-E3 PDF预览

SI5933CDC-T1-E3

更新时间: 2024-11-06 06:11:35
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
7页 144K
描述
Dual P-Channel 20-V (D-S) MOSFET

SI5933CDC-T1-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:SMALL OUTLINE, R-XDSO-C8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.75
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):3.7 A最大漏极电流 (ID):2.5 A
最大漏源导通电阻:0.144 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XDSO-C8JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):2.8 W最大脉冲漏极电流 (IDM):10 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:PURE MATTE TIN
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI5933CDC-T1-E3 数据手册

 浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第2页浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第3页浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第4页浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第5页浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第6页浏览型号SI5933CDC-T1-E3的Datasheet PDF文件第7页 
New Product  
Si5933CDC  
Vishay Siliconix  
Dual P-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
100 % Rg Tested  
VDS (V)  
RDS(on) (Ω)  
ID (A)a  
- 3.7  
Qg (Typ.)  
0.144 at VGS = - 4.5 V  
0.180 at VGS = - 2.5 V  
0.222 at VGS = - 1.8 V  
RoHS  
- 20  
- 3.0  
4.1 nC  
COMPLIANT  
APPLICATIONS  
Load Switch for Portable Devices  
- 3.0  
1206-8 ChipFET®  
1
S
1
S
2
S1  
D1  
G1  
D1  
S2  
G
1
G
2
Marking Code  
D2  
G2  
DI XXX  
Lot Traceability  
and Date Code  
D2  
Part #  
Code  
D
1
D
2
Bottom View  
P-Channel MOSFET  
P-Channel MOSFET  
Ordering Information: Si5933CDC-T1-E3 (Lead (Pb)-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
- 20  
8
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
TC = 25 °C  
- 3.7  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
- 3.0  
- 2.5b, c  
- 2.0b, c  
- 10  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
- 2.3  
- 1.1b, c  
2.8  
Continuous Source-Drain Diode Current  
T
A = 25 °C  
C = 25 °C  
T
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
1.8  
PD  
Maximum Power Dissipation  
W
1.3b, c  
0.8b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Symbol  
RthJA  
Typical  
82  
Maximum  
Unit  
t 5 s  
Steady State  
99  
45  
°C/W  
Maximum Junction-to-Foot (Drain)  
RthJF  
35  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not  
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required  
to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 130 °C/W.  
Document Number: 68822  
S-81731-Rev. A, 04-Aug-08  
www.vishay.com  
1

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