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SI5908DC_10

更新时间: 2024-09-15 09:25:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 236K
描述
Dual N-Channel 20 V (D-S) MOSFET

SI5908DC_10 数据手册

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Si5908DC  
Vishay Siliconix  
Dual N-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
5.9  
Definition  
TrenchFET® Power MOSFETs  
Ultra Low RDS(on) and Excellent Power  
Handling in Compact Footprint  
0.040 at VGS = 4.5 V  
0.045 at VGS = 2.5 V  
0.052 at VGS = 1.8 V  
20  
5.6  
5.2  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
Load Switch  
PA Switch  
Battery Switch  
1206-8 ChipFET®  
D
D
2
1
1
S
1
D
1
G
1
D
1
S
2
D
2
G
2
G
1
G
2
Marking Code  
D
2
CC XXX  
Lot Traceability  
and Date Code  
Part # Code  
Bottom View  
S
1
S
2
Ordering Information: Si5908DC-T1-E3 (Lead (Pb)-free)  
N-Channel MOSFET  
N-Channel MOSFET  
Si5908DC-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
5 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
20  
V
VGS  
8
TA = 25 °C  
TA = 85 °C  
5.9  
4.2  
4.4  
3.1  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IS  
Pulsed Drain Current  
20  
Continuous Source Current (Diode Conduction)a  
1.8  
2.1  
1.1  
0.9  
1.1  
0.6  
TA = 25 °C  
TA = 85 °C  
Maximum Power Dissipationa  
PD  
W
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
50  
Maximum  
Unit  
t 5 s  
60  
110  
40  
Maximum Junction-to-Ambienta  
Maximum Junction-to-Foot (Drain)  
RthJA  
Steady State  
Steady State  
90  
°C/W  
RthJF  
30  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73074  
S10-0548-Rev. B, 08-Mar-10  
www.vishay.com  
1

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