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NTTFS4C10N PDF预览

NTTFS4C10N

更新时间: 2024-11-21 01:14:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 119K
描述
Power MOSFET Dual N−Channel

NTTFS4C10N 数据手册

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NTTFS4C10N  
Power MOSFET  
30 V, 44 A, Single NChannel, m8FL  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
http://onsemi.com  
V
R
DS(on)  
MAX  
I MAX  
D
(BR)DSS  
Applications  
7.4 mW @ 10 V  
11 mW @ 4.5 V  
30 V  
44 A  
DCDC Converters  
Power Load Switch  
Notebook Battery Management  
NChannel MOSFET  
D (58)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
DSS  
30  
20  
V
V
A
GatetoSource Voltage  
V
GS  
Continuous Drain  
I
D
T = 25°C  
13.3  
9.9  
A
G (4)  
Current R  
(Note 1)  
q
JA  
T = 80°C  
A
Power Dissipation R  
(Note 1)  
T = 25°C  
P
2.09  
W
A
q
JA  
A
D
S (1,2,3)  
Continuous Drain  
I
D
T = 25°C  
A
18.2  
13.6  
3.9  
MARKING DIAGRAM  
Current R  
(Note 1)  
10 s  
q
JA  
T = 80°C  
A
1
1
S
S
S
G
D
D
D
D
Power Dissipation  
10 s (Note 1)  
T = 25°C  
A
P
I
W
A
D
D
D
4C10  
AYWWG  
G
WDFN8  
(m8FL)  
CASE 511AB  
R
q
JA  
Steady  
State  
Continuous Drain  
Current R (Note 2)  
T = 25°C  
A
8.2  
6.1  
D
q
JA  
T = 80°C  
A
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
0.79  
W
A
4C10  
A
Y
WW  
G
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= PbFree Package  
R
q
JA  
Continuous Drain  
Current R (Note 1)  
T
T
T
= 25°C  
= 80°C  
= 25°C  
44  
33  
D
C
C
C
q
JC  
Power Dissipation  
(Note 1)  
P
23.6  
W
(Note: Microdot may be in either location)  
R
q
JC  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
128  
A
A
p
Operating Junction and Storage Temperature  
T ,  
stg  
55 to  
°C  
ORDERING INFORMATION  
J
T
+150  
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
S
20  
6.0  
31  
A
NTTFS4C10NTAG  
WDFN8  
(PbFree)  
1500 / Tape &  
Reel  
Drain to Source dV/dt  
dV/dt  
V/ns  
mJ  
Single Pulse DraintoSource Avalanche Energy  
E
AS  
NTTFS4C10NTWG WDFN8  
5000 / Tape &  
Reel  
(T = 25°C, V = 50 V, V = 10 V, I = 25 A ,  
J
DD  
G
GS  
L
pk  
(PbFree)  
L = 0.1 mH, R = 25 W) (Note 3)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
(1/8from case for 10 s)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
3. This is the absolute maximum ratings. Parts are 100% tested at T = 25°C,  
J
V
GS  
= 10 V, I = 17 A, E = 14 mJ.  
L AS  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2013 Rev. 2  
NTTFS4C10N/D  
 

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