NTTFS4H05N
Power MOSFET
25 V, 94 A, Single N−Channel, m8−FL
Features
• Optimized Design to Minimize Conduction and Switching Losses
• Optimized Package to Minimize Parasitic Inductances
• Optimized material for improved thermal performance
www.onsemi.com
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
V
GS
MAX R
TYP Q
GTOT
DS(on)
• High Performance DC-DC Converters
• System Voltage Rails
• Netcom, Telecom
4.5 V
10 V
4.8 mW
8.7 nC
18.9 nC
3.3 mW
• Servers & Point of Load
PIN CONNECTIONS
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
m8−FL (3.3 x 3.3 mm)
Parameter
Drain-to-Source Voltage
Symbol
Value
25
Units
V
DSS
V
V
A
Gate-to-Source Voltage
V
GS
20
Continuous Drain Current R
(T = 25°C, Note 1)
A
I
D
22.4
q
JA
JC
(Top View)
(Bottom View)
Power Dissipation R
P
D
2.66
94
W
A
q
JA
(T = 25°C, Note 1)
A
Continuous Drain Current R
I
D
q
(T = 25°C, Note 1)
C
N−CHANNEL MOSFET
Power Dissipation R
(T = 25°C, Note 1)
C
P
D
46.3
W
q
JC
D (5−8)
Pulsed Drain Current (t = 10 ms)
I
304
84
A
p
DM
Single Pulse Drain-to-Source Avalanche
Energy (Note 1)
E
mJ
AS
G (4)
(I = 41 A , L = 0.1 mH) (Note 3)
L
pk
Drain to Source dV/dt
dV/dt
7
V/ns
°C
S (1,2,3)
Maximum Junction Temperature
Storage Temperature Range
T
150
J(max)
T
STG
−55 to
150
°C
ORDERING INFORMATION
See detailed ordering and shipping information on page 6 of
this data sheet.
Lead Temperature Soldering Reflow (SMD
Styles Only), Pb-Free Versions (Note 2)
T
SLD
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
2
2
1. Values based on copper area of 645 mm (or 1 in ) of 2 oz copper thickness
and FR4 PCB substrate.
2. For more information, please refer to our Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
3. This is the absolute maximum rating. Parts are 100% UIS tested at T = 25°C,
J
V
GS
= 10 V, I = 27 A, E = 36 mJ.
L AS
THERMALCHARACTERISTICS
Parameter
Symbol
Max
Units
Thermal Resistance,
Junction-to-Ambient (Note 1 and 4)
Junction-to-Case (Note 1 and 4)
°C/W
R
47
2.7
q
JA
JC
R
q
4. Thermal Resistance R
and R
as defined in JESD51−3.
JC
q
q
JA
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
July, 2015 − Rev. 3
NTTFS4H05N/D