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NTTFS4H05NTWG

更新时间: 2024-11-19 01:14:47
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安森美 - ONSEMI /
页数 文件大小 规格书
7页 93K
描述
Power MOSFET Single N−Channel

NTTFS4H05NTWG 数据手册

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NTTFS4H05N  
Power MOSFET  
25 V, 94 A, Single N−Channel, m8−FL  
Features  
Optimized Design to Minimize Conduction and Switching Losses  
Optimized Package to Minimize Parasitic Inductances  
Optimized material for improved thermal performance  
www.onsemi.com  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
Applications  
V
GS  
MAX R  
TYP Q  
GTOT  
DS(on)  
High Performance DC-DC Converters  
System Voltage Rails  
Netcom, Telecom  
4.5 V  
10 V  
4.8 mW  
8.7 nC  
18.9 nC  
3.3 mW  
Servers & Point of Load  
PIN CONNECTIONS  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
m8−FL (3.3 x 3.3 mm)  
Parameter  
Drain-to-Source Voltage  
Symbol  
Value  
25  
Units  
V
DSS  
V
V
A
Gate-to-Source Voltage  
V
GS  
20  
Continuous Drain Current R  
(T = 25°C, Note 1)  
A
I
D
22.4  
q
JA  
JC  
(Top View)  
(Bottom View)  
Power Dissipation R  
P
D
2.66  
94  
W
A
q
JA  
(T = 25°C, Note 1)  
A
Continuous Drain Current R  
I
D
q
(T = 25°C, Note 1)  
C
N−CHANNEL MOSFET  
Power Dissipation R  
(T = 25°C, Note 1)  
C
P
D
46.3  
W
q
JC  
D (5−8)  
Pulsed Drain Current (t = 10 ms)  
I
304  
84  
A
p
DM  
Single Pulse Drain-to-Source Avalanche  
Energy (Note 1)  
E
mJ  
AS  
G (4)  
(I = 41 A , L = 0.1 mH) (Note 3)  
L
pk  
Drain to Source dV/dt  
dV/dt  
7
V/ns  
°C  
S (1,2,3)  
Maximum Junction Temperature  
Storage Temperature Range  
T
150  
J(max)  
T
STG  
−55 to  
150  
°C  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
Lead Temperature Soldering Reflow (SMD  
Styles Only), Pb-Free Versions (Note 2)  
T
SLD  
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
2
1. Values based on copper area of 645 mm (or 1 in ) of 2 oz copper thickness  
and FR4 PCB substrate.  
2. For more information, please refer to our Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
3. This is the absolute maximum rating. Parts are 100% UIS tested at T = 25°C,  
J
V
GS  
= 10 V, I = 27 A, E = 36 mJ.  
L AS  
THERMALCHARACTERISTICS  
Parameter  
Symbol  
Max  
Units  
Thermal Resistance,  
Junction-to-Ambient (Note 1 and 4)  
Junction-to-Case (Note 1 and 4)  
°C/W  
R
47  
2.7  
q
JA  
JC  
R
q
4. Thermal Resistance R  
and R  
as defined in JESD51−3.  
JC  
q
q
JA  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
July, 2015 − Rev. 3  
NTTFS4H05N/D  
 

NTTFS4H05NTWG 替代型号

型号 品牌 替代类型 描述 数据表
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Power MOSFET Single N−Channel

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