NTTFS5820NL
Power MOSFET
60 V, 37 A, 11.5 mW
Features
• Low R
DS(on)
http://onsemi.com
• Low Capacitance
• Optimized Gate Charge
• These Devices are Pb−Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
11.5 mW @ 10 V
15 mW @ 4.5 V
60 V
37 A
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol Value Unit
N−Channel MOSFET
D (5−8)
V
60
20
11
V
V
A
DSS
Gate−to−Source Voltage
V
GS
Continuous Drain
T = 25°C
I
D
A
Current R
(Note 1)
q
JA
T = 100°C
A
7
G (4)
Power Dissipation R
(Note 1)
T = 25°C
P
2.7
1.1
37
24
33
13
149
W
A
q
D
D
JA
A
T = 100°C
A
Steady
State
S (1,2,3)
Continuous Drain
T
= 25°C
= 100°C
= 25°C
I
D
C
Current R
(Note 1)
q
JC
T
C
MARKING DIAGRAM
1
Power Dissipation
(Note 1)
T
C
P
W
1
S
S
S
G
D
D
D
D
R
q
JC
T
C
= 100°C
5820
AYWWG
G
WDFN8
(m8FL)
CASE 511AB
Pulsed Drain Current
t = 10 ms
I
A
p
DM
Operating Junction and Storage Temperature
T ,
−55 to
+150
°C
J
stg
T
5820
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Source Current (Body Diode)
I
37
48
A
mJ
A
S
Single Pulse Drain−to−Source
Avalanche Energy
L = 0.1 mH
E
AS
AS
I
31
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
(Note: Microdot may be in either location)
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
NTTFS5820NLTAG WDFN8 1500 / Tape & Reel
(Pb−Free)
THERMAL RESISTANCE MAXIMUM RATINGS
NTTFS5820NLTWG WDFN8 5000 / Tape & Reel
Parameter
Symbol
Value
Unit
(Pb−Free)
Junction−to−Case – Steady
State (Note 1)
R
3.8
°C/W
q
JC
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction−to−Ambient – Steady
State (Note 1)
R
46.7
q
JA
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 0
NTTFS5820NL/D