DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel, Logic Level,
m8FL
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
5.3 mW @ 10 V
8.4 mW @ 4.5 V
80 V
79 A
80 V, 5.3 mW, 79 A
D (5−8)
NTTFS5D6N08XL
Features
• Low Q , Soft Recovery Body Diode
G (4)
RR
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
S (1,2,3)
N−CHANNEL MOSFET
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
MARKING
DIAGRAM
• Synchronous Rectification (SR) in DC−DC and AC−DC
• Primary Switch in Isolated DC−DC Converter
• Motor Drives
1
S5D6
AYWW
WDFN8
(m8FL)
CASE 511DY
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
S5D6 = Specific Device Code
A
Y
= Assembly Location
= Year Code
V
DSS
Gate−to−Source Voltage
V
GS
20
V
WW = Work Week Code
Continuous Drain Current
(Notes 1, 2)
T
= 25°C
= 100°C
= 25°C
I
79
A
C
C
C
D
T
C
56
ORDERING INFORMATION
Power Dissipation (Note 1)
T
P
82
W
A
D
†
Device
NTTFS5D6N08XLTAG
Package
Shipping
T
C
= 100°C
= 25°C,
41
WDFN8
(m8FL)
1500 / Tape
& Reel
Pulsed Drain Current
T
I
290
290
DM
t = 100 ms
p
Pulsed Source Current
(Body Diode)
I
SM
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
STG
Source Current (Body Diode)
Single Pulse Avalanche Energy
I
118
57
A
S
E
AS
mJ
(I = 34 A) (Note 3)
PK
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Actual continuous current will be limited by thermal & electromechanical
application board design.
3. E of 57 mJ is based on T = 25°C; L = 0.1 mH, I = 34 A, V = 64 V,
AS
GS
J
AS
DD
V
= 10 V. 100% tested
© Semiconductor Components Industries, LLC, 2023
1
Publication Order Number:
January, 2024 − Rev. 0
NTTFS5D6N08XL/D