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NTTFS5826NL PDF预览

NTTFS5826NL

更新时间: 2024-11-18 12:33:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 113K
描述
NTTFS5826NL 60 V, 24 m, Single N−Channel, 8FL

NTTFS5826NL 数据手册

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NTTFS5826NL  
Power MOSFET  
60 V, 24 mW, Single NChannel, m8FL  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Designs  
Low Q  
to Minimize Switching Losses  
Low Capacitance to Minimize Driver Losses  
G(TOT)  
http://onsemi.com  
These are PbFree Devices  
Applications  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Motor Drivers  
24 mW @ 10 V  
32 mW @ 4.5 V  
60 V  
20 A  
DCDC Converters  
Synchronous Rectification  
Power Management  
NChannel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
"20  
20  
V
G
GS  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
A
mb  
D
Y
Jmb  
S
T
mb  
14  
19  
10  
8
(Notes 1, 2, and 3)  
Power Dissipation  
T
mb  
P
W
A
D
R
(Notes 1, 2,  
MARKING DIAGRAM  
Y
Jmb  
T
mb  
= 100°C  
and 3)  
Steady  
State  
1
1
S
S
S
G
D
D
D
D
Continuous Drain  
T = 25°C  
I
A
D
5826  
AYWWG  
G
WDFN8  
(m8FL)  
Current R  
& 3)  
(Notes 1  
q
JA  
T = 100°C  
A
6
CASE 511AB  
Power Dissipation  
(Notes 1 & 3)  
T = 25°C  
P
3.1  
1.6  
133  
W
A
D
R
q
JA  
T = 100°C  
A
5826  
A
Y
WW  
G
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= PbFree Package  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
J
55 to  
175  
°C  
stg  
Source Current (Body Diode)  
I
S
20  
20  
A
(Note: Microdot may be in either location)  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (T = 25°C, V = 50 V, V = 10 V,  
J
DD  
GS  
I
= 14.4 A, L = 1.0 mH, R = 25 W)  
L(pk)  
G
ORDERING INFORMATION  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Device  
Package  
Shipping  
NTTFS5826NLTAG WDFN8 1500/Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
(PbFree)  
NTTFS5826NLTWG WDFN8 5000/Tape & Reel  
(PbFree)  
THERMAL RESISTANCE MAXIMUM RATINGS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Parameter  
Symbol  
Value  
Unit  
JunctiontoMounting Board (top) Steady  
State (Notes 2, 3)  
R
7.9  
°C/W  
Y
Jmb  
JunctiontoAmbient Steady State (Note 3)  
R
48  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
November, 2011 Rev. 2  
NTTFS5826NL/D  
 

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