NTTFS5826NL
Power MOSFET
60 V, 24 mW, Single N−Channel, m8FL
Features
• Small Footprint (3.3 x 3.3 mm) for Compact Designs
• Low Q
to Minimize Switching Losses
• Low Capacitance to Minimize Driver Losses
G(TOT)
http://onsemi.com
• These are Pb−Free Devices
Applications
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• Motor Drivers
24 mW @ 10 V
32 mW @ 4.5 V
60 V
20 A
• DC−DC Converters
• Synchronous Rectification
• Power Management
N−Channel
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
Gate−to−Source Voltage
V
"20
20
V
G
GS
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
A
mb
D
Y
J−mb
S
T
mb
14
19
10
8
(Notes 1, 2, and 3)
Power Dissipation
T
mb
P
W
A
D
R
(Notes 1, 2,
MARKING DIAGRAM
Y
J−mb
T
mb
= 100°C
and 3)
Steady
State
1
1
S
S
S
G
D
D
D
D
Continuous Drain
T = 25°C
I
A
D
5826
AYWWG
G
WDFN8
(m8FL)
Current R
& 3)
(Notes 1
q
JA
T = 100°C
A
6
CASE 511AB
Power Dissipation
(Notes 1 & 3)
T = 25°C
P
3.1
1.6
133
W
A
D
R
q
JA
T = 100°C
A
5826
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
T , T
J
−55 to
175
°C
stg
Source Current (Body Diode)
I
S
20
20
A
(Note: Microdot may be in either location)
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (T = 25°C, V = 50 V, V = 10 V,
J
DD
GS
I
= 14.4 A, L = 1.0 mH, R = 25 W)
L(pk)
G
ORDERING INFORMATION
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
†
Device
Package
Shipping
NTTFS5826NLTAG WDFN8 1500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
(Pb−Free)
NTTFS5826NLTWG WDFN8 5000/Tape & Reel
(Pb−Free)
THERMAL RESISTANCE MAXIMUM RATINGS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Parameter
Symbol
Value
Unit
Junction−to−Mounting Board (top) − Steady
State (Notes 2, 3)
R
7.9
°C/W
Y
J−mb
Junction−to−Ambient − Steady State (Note 3)
R
48
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 2
NTTFS5826NL/D