NTTFS5116PL
Power MOSFET
−60 V, −20 A, 52 mW
Features
• Low R
DS(on)
• Fast Switching
http://onsemi.com
• These Devices are Pb−Free and are RoHS Compliant
Applications
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• Load Switches
• DC Motor Control
• DC−DC Conversion
52 mW @ −10 V
72 mW @ −4.5 V
−60 V
−20 A
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
P−Channel MOSFET
D (5−8)
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
DSS
−60
20
V
V
A
Gate−to−Source Voltage
V
GS
Continuous Drain
I
D
T = 25°C
−5.7
A
Current R
(Note 1)
q
JA
T = 100°C
A
−4.0
3.2
G (4)
Power Dissipation R
(Note 1)
P
W
A
T = 25°C
T = 100°C
A
q
D
JA
A
1.6
Steady
State
S (1,2,3)
Continuous Drain
I
D
T
C
= 25°C
−20
−14
Current R
(Note 1)
q
JC
T
C
= 100°C
MARKING DIAGRAM
Power Dissipation
(Note 1)
P
D
W
1
T
= 25°C
= 100°C
40
20
C
1
R
S
S
S
G
D
D
D
D
q
JC
T
C
5116
AYWWG
G
WDFN8
(m8FL)
Pulsed Drain Current
t = 10 ms
p
I
−76
A
DM
Operating Junction and Storage Temperature
T ,
stg
−55 to
+175
°C
CASE 511AB
J
T
Source Current (Body Diode)
I
−20
A
S
5116
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Single Pulse Drain−to−Source Ava- L = 0.1 mH
lanche Energy
E
AS
45
30
mJ
A
I
AS
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
THERMAL RESISTANCE MAXIMUM RATINGS
NTTFS5116PLTAG
WDFN8 1500/Tape & Reel
(Pb−Free)
Parameter
Symbol
Value
Unit
°C/W
Junction−to−Case – Steady
State (Note 1)
R
3.8
q
JC
NTTFS5116PLTWG WDFN8 5000/Tape & Reel
(Pb−Free)
Junction−to−Ambient – Steady
R
47
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
State (Note 1)
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 1
NTTFS5116PL/D