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NTR4170NT1G PDF预览

NTR4170NT1G

更新时间: 2024-01-05 00:14:26
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 101K
描述
Power MOSFET 30 V, 3.2 A, Single N−Channel, SOT−23

NTR4170NT1G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT-23包装说明:LEAD FREE, CASE 318-08, TO-236, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:1.04Samacsys Description:Power MOSFET
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):3.2 A最大漏极电流 (ID):3.2 A
最大漏源导通电阻:0.055 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.25 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

NTR4170NT1G 数据手册

 浏览型号NTR4170NT1G的Datasheet PDF文件第2页浏览型号NTR4170NT1G的Datasheet PDF文件第3页浏览型号NTR4170NT1G的Datasheet PDF文件第4页浏览型号NTR4170NT1G的Datasheet PDF文件第5页 
NTR4170N  
Power MOSFET  
30 V, 3.2 A, Single NChannel, SOT23  
Features  
Low R  
DS(on)  
Low Gate Charge  
Low Threshold Voltage  
Halide Free  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
This is a PbFree Device  
55 mW @ 10 V  
70 mW @ 4.5 V  
110 mW @ 2.5 V  
3.2 A  
2.8 A  
2.0 A  
30 V  
Applications  
Power Converters for Portables  
Battery Management  
Load/Power Switch  
SIMPLIFIED SCHEMATIC NCHANNEL  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol Value  
Unit  
V
V
DSS  
30  
12  
G
GatetoSource Voltage  
V
GS  
V
Continuous Drain  
Current (Note 1)  
T = 25°C  
3.2  
2.3  
4.0  
0.78  
A
t 30 s  
S
T = 85°C  
A
I
A
D
MARKING DIAGRAM/  
PIN ASSIGNMENT  
t 10 s T = 25°C  
A
Power Dissipation  
(Note 1)  
Steady  
State  
W
3
3
Drain  
T = 25°C  
A
P
D
t 10 s  
1.25  
8.0  
1
Pulsed Drain Current  
t = 10 ms  
I
A
°C  
A
p
DM  
TREMG  
2
G
Operating Junction and Storage Temperature  
T ,  
T
stg  
55 to  
150  
J
SOT23  
CASE 318  
STYLE 21  
1
1
Gate  
2
Source Current (Body Diode)  
I
0.78  
260  
S
Source  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
°C  
TRE  
M
= Specific Device Code  
= Date Code  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
G
= PbFree Package  
(Note: Microdot may be in either location)  
THERMAL RESISTANCE RATINGS  
ORDERING INFORMATION  
Parameter  
Symbol  
Max  
260  
153  
100  
Unit  
Device  
Package  
Shipping  
JunctiontoAmbient Steady State (Note 1)  
JunctiontoAmbient t 30 s  
R
°C/W  
q
JA  
NTR4170NT1G  
SOT23  
(PbFree)  
3000/Tape & Reel  
R
q
JA  
JunctiontoAmbient t < 10 s (Note 1)  
R
q
JA  
NTR4170NT3G  
SOT23  
10000/Tape & Reel  
(PbFree)  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[2 oz] including traces).  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
June, 2008 Rev. 0  
NTR4170N/D  
 

NTR4170NT1G 替代型号

型号 品牌 替代类型 描述 数据表
FDN337N ONSEMI

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N 沟道,逻辑电平增强型场效应晶体管,30V,2.2A,65mΩ
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