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FDN337N PDF预览

FDN337N

更新时间: 2024-09-28 11:14:27
品牌 Logo 应用领域
安森美 - ONSEMI 晶体管场效应晶体管
页数 文件大小 规格书
6页 260K
描述
N 沟道,逻辑电平增强型场效应晶体管,30V,2.2A,65mΩ

FDN337N 数据手册

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DATA SHEET  
www.onsemi.com  
D
S
Transistor - N-Channel,  
Logic Level, Enhancement  
Mode Field Effect  
G
FDN337N  
General Description  
SUPERSOTt3 NChannel logic level enhancement mode power  
field effect transistors are produced using onsemi’s proprietary, high  
cell density, DMOS technology. This very high density process is  
especially tailored to minimize onstate resistance. These devices are  
particularly suited for low voltage applications in notebook  
computers, portable phones, PCMCIA cards, and other battery  
powered circuits where fast switching, and low inline power loss are  
needed in a very small outline surface mount package.  
SOT233  
CASE 527AG  
MARKING DIAGRAM  
&E&Y  
618&E&G  
Features  
2.2 A, 30 V  
R  
R  
= 0.065 @ V = 4.5 V  
GS  
DS(on)  
&E  
&Y  
618  
&G  
= Designates Space  
= 0.082 @ V = 2.5 V  
DS(on)  
GS  
= Binary Calendar Year Coding Scheme  
= Specific Device Code  
= Date Code  
Industry Standard Outline SOT23 Surface Mount Package Using  
Proprietary SUPERSOT3 Design for Superior Thermal and  
Electrical Capabilities  
ORDERING INFORMATION  
High Density Cell Design for Extremely Low R  
DS(on)  
Exceptional onResistance and Maximum DC Current Capability  
This Device is PbFree and Halogen Free  
Device  
FDN337N  
Package  
Shipping  
SOT233  
(PbFree)  
3000 /  
Tape & Reel  
ABSOLUTE MAXIMUM RATINGS  
A
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
T = 25°C unless otherwise noted.  
Symbol  
Parameter  
Ratings  
Unit  
V
V
DrainSource Voltage  
30  
DSS  
GSS  
V
GateSource Voltage Continuous  
Drain/Output Current – Continuous  
Drain/Output Current – Pulsed  
Maximum Power Dissipation (Note 1a)  
Maximum Power Dissipation (Note 1b)  
8
2.2  
V
I
D
A
10  
P
0.5  
W
D
0.46  
T , T  
Operating and Storage Temperature  
Range  
55 to +150  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
T = 25°C unless otherwise noted.  
A
Symbol  
Parameter  
Ratings  
Unit  
R
Thermal Resistance,  
JunctiontoAmbient (Note 1a)  
250  
°C/W  
JA  
R
Thermal Resistance,  
JunctiontoCase (Note 1)  
75  
°C/W  
JC  
© Semiconductor Components Industries, LLC, 1998  
1
Publication Order Number:  
March, 2022 Rev. 4  
FDN337N/D  

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