NTR4101P
Trench Power MOSFET
−20 V, Single P−Channel, SOT−23
Features
• Leading −20 V Trench for Low R
DS(on)
• −1.8 V Rated for Low Voltage Gate Drive
• SOT−23 Surface Mount for Small Footprint
• Pb−Free Package is Available
http://onsemi.com
Applications
V
R
TYP
I MAX
D
(BR)DSS
DS(ON)
• Load/Power Management for Portables
• Load/Power Management for Computing
• Charging Circuits and Battery Protection
70 mW @ −4.5 V
90 mW @ −2.5 V
112 mW @ −1.8 V
−20 V
−3.2 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
P−Channel MOSFET
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
S
V
DSS
−20
±8.0
−2.4
−1.7
−3.2
0.73
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current (Note 1)
Steady T = 25°C
State
I
D
A
G
A
T = 85°C
A
t ≤ 10 s T = 25°C
A
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
D
W
A
D
t ≤ 10 s
1.25
−1.8
−1.3
0.42
MARKING DIAGRAM &
PIN ASSIGNMENT
Continuous Drain
Current (Note 2)
Steady T = 25°C
State
I
A
A
D
T = 85°C
A
3
Power Dissipation
(Note 2)
T = 25°C
A
P
W
D
3
Drain
Pulsed Drain Current
tp = 10 ms
I
−7.5
225
A
V
DM
TR4
W
1
ESD Capability (Note 3)
C = 100 pF,
RS = 1500 W
ESD
2
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
SOT−23
CASE 318
STYLE 21
J
1
Gate
2
T
STG
Source
Source Current (Body Diode)
I
S
−2.4
260
A
TR4
W
= Device Code
= Work Week
Lead Temperature for Soldering
Purposes (1/8” from case for 10 s)
T
L
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
†
Device
Package
Shipping
THERMAL RESISTANCE RATINGS
NTR4101PT1
SOT−23
3000/Tape & Reel
3000/Tape & Reel
Parameter
Symbol
Max
170
100
300
Unit
NTR4101PT1G
SOT−23
Pb−Free
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t < 10 s (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
q
q
JA
JA
JA
R
R
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
3. ESD Rating Information: HBM Class 0
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
October, 2004 − Rev. 3
NTR4101P/D