Product specification
NTR4101P, NTRV4101P
Trench Power MOSFET
−20 V, Single P−Channel, SOT−23
V
R
TYP
I MAX
D
(BR)DSS
DS(ON)
70 mW @ −4.5 V
90 mW @ −2.5 V
112 mW @ −1.8 V
Features
−20 V
−3.2 A
• Leading −20 V Trench for Low R
DS(on)
• −1.8 V Rated for Low Voltage Gate Drive
• SOT−23 Surface Mount for Small Footprint
P−Channel MOSFET
• NTRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
S
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
G
Applications
• Load/Power Management for Portables
• Load/Power Management for Computing
• Charging Circuits and Battery Protection
D
MARKING DIAGRAM &
PIN ASSIGNMENT
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
3
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
3
Drain
V
−20
8.0
DSS
Gate−to−Source Voltage
V
V
GS
1
TR4 MG
Continuous Drain
Current (Note 1)
Steady T = 25°C
State
I
−2.4
−1.7
−3.2
0.73
A
A
D
G
2
T = 85°C
A
SOT−23
CASE 318
STYLE 21
1
Gate
2
t ≤ 10 s T = 25°C
A
Source
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
W
A
D
TR4
M
G
= Device Code
= Date Code
t ≤ 10 s
1.25
−1.8
−1.3
0.42
= Pb−Free Package
(*Note: Microdot may be in either location)
Continuous Drain
Current (Note 2)
Steady T = 25°C
State
I
A
A
D
T = 85°C
A
Power Dissipation
(Note 2)
T = 25°C
A
P
W
D
ORDERING INFORMATION
Pulsed Drain Current
tp = 10 ms
I
−18
A
V
DM
†
Device
Package
Shipping
ESD Capability (Note 3)
C = 100 pF,
RS = 1500 W
ESD
225
NTR4101PT1G
NTR4101PT1H
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
T
STG
NTRV4101PT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Source Current (Body Diode)
I
S
−2.4
A
Single Pulse Drain−to−Source Avalanche
EAS
16
mJ
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Energy (V = −8 V, I = −1.8 Apk, L = 10 mH,
GS
= 25 W)
L
R
G
Lead Temperature for Soldering
Purposes (1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
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