MOSFET – Power, Single,
N-Channel
60 V, 1.8 mW, 185 A
NTMFS5H615NL
Features
• Small Footprint (5x6 mm) for Compact Design
www.onsemi.com
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
• These Devices are Pb−Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
1.8 mW @ 10 V
2.5 mW @ 4.5 V
60 V
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
185 A
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
D (5)
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
185
117
139
55
A
C
D
q
JC
T
C
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
W
A
G (4)
D
R
(Note 1)
q
JC
T
C
= 100°C
S (1,2,3)
N−CHANNEL MOSFET
Continuous Drain
Current R
T = 25°C
A
I
D
28
q
JA
T = 100°C
A
18
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
3.2
1.3
900
W
D
R
(Notes 1, 2)
q
JA
MARKING
DIAGRAM
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D
1
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
S
S
S
G
D
D
+150
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
5H615L
AYWZZ
Source Current (Body Diode)
I
S
116
419
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
D
Energy (I
= 16 A)
L(pk)
5H615L = Specific Device Code
Lead Temperature for Soldering Purposes
T
260
°C
L
A
Y
= Assembly Location
= Year
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
W
ZZ
= Work Week
= Lot Traceability
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.9
Unit
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
39
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
June, 2021 − Rev. 1
NTMFS5H615NL/D