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NTMFS5H615NLT1G PDF预览

NTMFS5H615NLT1G

更新时间: 2024-09-15 11:15:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 220K
描述
单 N 沟道,功率 MOSFET,60V,200A,1.8mΩ

NTMFS5H615NLT1G 数据手册

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MOSFET – Power, Single,  
N-Channel  
60 V, 1.8 mW, 185 A  
NTMFS5H615NL  
Features  
Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1.8 mW @ 10 V  
2.5 mW @ 4.5 V  
60 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
185 A  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
D (5)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
185  
117  
139  
55  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
W
A
G (4)  
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
S (1,2,3)  
NCHANNEL MOSFET  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
28  
q
JA  
T = 100°C  
A
18  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.3  
900  
W
D
R
(Notes 1, 2)  
q
JA  
MARKING  
DIAGRAM  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D
1
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
S
S
S
G
D
D
+150  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
5H615L  
AYWZZ  
Source Current (Body Diode)  
I
S
116  
419  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
D
Energy (I  
= 16 A)  
L(pk)  
5H615L = Specific Device Code  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
A
Y
= Assembly Location  
= Year  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
ZZ  
= Work Week  
= Lot Traceability  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.9  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2021 Rev. 1  
NTMFS5H615NL/D  
 

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