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NTMFS5H630NLT1G PDF预览

NTMFS5H630NLT1G

更新时间： 2024-11-03 11:13:07
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 216K
描述
Single N-Channel Power MOSFET 60V, 120A, 3.1mΩ

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NTMFS5H630NLT1G 数据手册

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MOSFET – Power, Single,  
N-Channel  
60 V, 3.1 mW, 120 A  
NTMFS5H630NL  
Features  
• Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
• Low R  
to Minimize Conduction Losses  
DS(on)  
• Low Q and Capacitance to Minimize Driver Losses  
G
• These Devices are Pb−Free and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
3.1 mW @ 10 V  
4.4 mW @ 4.5 V  
60 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
120 A  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
GS  
20  
V
D (5)  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
120  
76  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
89  
W
A
D
G (4)  
R
(Note 1)  
q
JC  
T
C
= 100°C  
36  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
22  
S (1,2,3)  
N−CHANNEL MOSFET  
q
JA  
T = 100°C  
A
14  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.1  
1.3  
748  
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D
Operating Junction and Storage Temperature  
T , T  
−55 to  
°C  
1
J
stg  
S
S
S
G
D
D
+150  
DFN5  
(SO−8FL)  
CASE 488AA  
STYLE 1  
5H630L  
AYWZZ  
Source Current (Body Diode)  
I
S
74.4  
838  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy (I  
= 8.7 A)  
D
L(pk)  
Lead Temperature for Soldering Purposes  
T
260  
°C  
5H630L = Specific Device Code  
L
(1/8″ from case for 10 s)  
A
Y
= Assembly Location  
= Year  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
ZZ  
= Work Week  
= Lot Traceability  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
1.4  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Junction−to−Case − Steady State  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
JC  
R
40  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
February, 2020 − Rev. 1  
NTMFS5H630NL/D  
 
1234567

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