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NTF3055L108/D PDF预览

NTF3055L108/D

更新时间: 2024-01-15 10:24:54
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8页 58K
描述
Power MOSFET 3.0 Amps, 60 Volts, Logic Level

NTF3055L108/D 数据手册

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NTF3055L108  
Preferred Device  
Power MOSFET  
3.0 Amps, 60 Volts, Logic Level  
N–Channel SOT–223  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
3.0 AMPERES  
60 VOLTS  
Applications  
Power Supplies  
Converters  
R
= 108 mW  
DS(on)  
Power Motor Controls  
Bridge Circuits  
N–Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
G
Drain–to–Source Voltage  
V
DSS  
60  
60  
Drain–to–Gate Voltage (R  
= 1.0 M)  
V
DGR  
GS  
S
Gate–to–Source Voltage  
– Continuous  
V
GS  
± 15  
± 20  
Vdc  
Vpk  
– Non–repetitive (t 10 ms)  
p
MARKING  
DIAGRAM  
Drain Current  
– Continuous @ T = 25°C  
Adc  
Apk  
I
I
3.0  
1.4  
9.0  
A
D
D
– Continuous @ T = 100°C  
A
4
I
– Single Pulse (t 10 µs)  
DM  
p
SOT–223  
CASE 318E  
STYLE 3  
3055L  
LWW  
Total Power Dissipation @ T = 25°C (Note 1.)  
P
2.1  
1.3  
Watts  
Watts  
0.014 W/°C  
A
D
1
Total Power Dissipation @ T = 25°C (Note 2.)  
A
2
3
Derate above 25°C  
Operating and Storage Temperature Range  
T , T  
stg  
–55 to  
175  
°C  
J
3055L = Device Code  
L
WW  
= Location Code  
= Work Week  
Single Pulse Drain–to–Source Avalanche  
E
AS  
74  
mJ  
Energy – Starting T = 25°C  
J
GS  
(V  
= 25 Vdc, V  
= 5.0 Vdc,  
DD  
PIN ASSIGNMENT  
I (pk) = 7.0 Apk, L = 3.0 mH, V  
L
= 60 Vdc)  
DS  
4
Drain  
Thermal Resistance  
°C/W  
°C  
–Junction to Ambient (Note 1.)  
–Junction to Ambient (Note 2.)  
R
R
72.3  
114  
θJA  
θJA  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
260  
L
1. When surface mounted to an FR4 board using 1pad size, 1 oz. (Cu. Area  
2
1
2
3
Gate Drain Source  
0.0995 in ).  
2. When surface mounted to an FR4 board using minimum recommended pad  
2
size, 2–2.4 oz. (Cu. Area 0.272 in ).  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTF3055L108T1  
NTF3055L108T3  
SOT–223 1000 Tape & Reel  
SOT–223 4000 Tape & Reel  
NTF3055L108T3LF SOT–223 4000 Tape & Reel  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
June, 2001 – Rev. 0  
NTF3055L108/D  

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