NTF6P02T3
Power MOSFET
-10 Amps, -20 Volts
P−Channel SOT−223
http://onsemi.com
Features
• Low R
DS(on)
−10 AMPERES
−20 VOLTS
RDS(on) = 44 mW (Typ.)
• Logic Level Gate Drive
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• Pb−Free Package is Available
S
Typical Applications
G
• Power Management in Portables and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current (Note 1)
Symbol
Value
−20
Unit
Vdc
Vdc
P−Channel MOSFET
V
DSS
MARKING DIAGRAM
& PIN ASSIGNMENT
V
GS
8.0
Drain
4
− Continuous @ T = 25°C
I
−10
−8.4
−35
Adc
4
A
D
D
− Continuous @ T = 70°C
I
A
1
− Single Pulse (t = 10 ms)
I
Apk
W
p
DM
2
3
AYW
6P02G
G
Total Power Dissipation @ T = 25°C
P
D
8.3
A
SOT−223
CASE 318E
STYLE 3
Operating and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
Single Pulse Drain−to−Source Avalanche
E
150
mJ
°C/W
°C
1
2
3
AS
Energy − Starting T = 25°C
Gate Drain Source
J
(V = −20 Vdc, V = −5.0 Vdc,
DD
L(pk)
GS
I
= −10 A, L = 3.0 mH, R = 25W)
A
Y
W
6P02
G
= Assembly Location
G
= Year
Thermal Resistance
= Work Week
= Specific Device Code
= Pb−Free Package
− Junction to Lead (Note 1)
− Junction to Ambient (Note 2)
− Junction to Ambient (Note 3)
R
R
15
71.4
160
q
JL
JA
JA
q
q
R
(Note: Microdot may be in either location)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
260
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Steady State.
2. When surface mounted to an FR4 board using 1” pad size,
(Cu. Area 1.127 sq in), Steady State.
ORDERING INFORMATION
†
Device
Package
Shipping
NTF6P02T3
SOT−223 4000/Tape & Reel
4000/Tape & Reel
SOT−223
(Pb−Free)
NTF6P02T3G
3. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu. Area 0.412 sq in), Steady State.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
January, 2010 − Rev. 3
NTF6P02T3/D