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NTF6P02T3-D PDF预览

NTF6P02T3-D

更新时间: 2024-11-02 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 134K
描述
Power MOSFET -10 Amps, -20 Volts P−Channel SOT−223

NTF6P02T3-D 数据手册

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NTF6P02T3  
Power MOSFET  
-10 Amps, -20 Volts  
PChannel SOT223  
http://onsemi.com  
Features  
Low R  
DS(on)  
10 AMPERES  
20 VOLTS  
RDS(on) = 44 mW (Typ.)  
Logic Level Gate Drive  
Diode Exhibits High Speed, Soft Recovery  
Avalanche Energy Specified  
PbFree Package is Available  
S
Typical Applications  
G
Power Management in Portables and BatteryPowered Products,  
i.e.: Cellular and Cordless Telephones and PCMCIA Cards  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D
Rating  
DraintoSource Voltage  
GatetoSource Voltage  
Drain Current (Note 1)  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
PChannel MOSFET  
V
DSS  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
V
GS  
8.0  
Drain  
4
Continuous @ T = 25°C  
I
10  
8.4  
35  
Adc  
4
A
D
D
Continuous @ T = 70°C  
I
A
1
Single Pulse (t = 10 ms)  
I
Apk  
W
p
DM  
2
3
AYW  
6P02G  
G
Total Power Dissipation @ T = 25°C  
P
D
8.3  
A
SOT223  
CASE 318E  
STYLE 3  
Operating and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
Single Pulse DraintoSource Avalanche  
E
150  
mJ  
°C/W  
°C  
1
2
3
AS  
Energy Starting T = 25°C  
Gate Drain Source  
J
(V = 20 Vdc, V = 5.0 Vdc,  
DD  
L(pk)  
GS  
I
= 10 A, L = 3.0 mH, R = 25W)  
A
Y
W
6P02  
G
= Assembly Location  
G
= Year  
Thermal Resistance  
= Work Week  
= Specific Device Code  
= PbFree Package  
Junction to Lead (Note 1)  
Junction to Ambient (Note 2)  
Junction to Ambient (Note 3)  
R
R
15  
71.4  
160  
q
JL  
JA  
JA  
q
q
R
(Note: Microdot may be in either location)  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
260  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Steady State.  
2. When surface mounted to an FR4 board using 1” pad size,  
(Cu. Area 1.127 sq in), Steady State.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTF6P02T3  
SOT223 4000/Tape & Reel  
4000/Tape & Reel  
SOT223  
(PbFree)  
NTF6P02T3G  
3. When surface mounted to an FR4 board using minimum recommended pad  
size, (Cu. Area 0.412 sq in), Steady State.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
January, 2010 Rev. 3  
NTF6P02T3/D  
 

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