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NTB60N06 PDF预览

NTB60N06

更新时间: 2024-09-12 22:28:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
10页 89K
描述
60 V, 60 A, N−Channel TO−220 and D2PAK

NTB60N06 数据手册

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NTP60N06, NTB60N06  
Power MOSFET  
60 V, 60 A, N−Channel  
TO−220 and D2PAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
60 VOLTS, 60 AMPERES  
Features  
RDS(on) = 14 mW  
Pb−Free Packages are Available  
N−Channel  
D
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAMS  
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
4
Drain−to−Source Voltage  
V
60  
60  
DSS  
DGR  
Drain  
Drain−to−Gate Voltage (R = 10 MW)  
V
GS  
4
Gate−to−Source Voltage  
− Continuous  
V
V
"20  
"30  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
TO−220  
CASE 221A  
STYLE 5  
NTx60N06  
Drain Current  
− Continuous @ T = 25°C  
AYWW  
I
D
60  
42.3  
180  
Adc  
Apk  
A
− Continuous @ T = 100°C  
I
D
A
− Single Pulse (t v10 ms)  
I
DM  
p
1
Gate  
3
1
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
150  
1.0  
2.4  
W
W/°C  
W
2
A
Source  
3
2
Total Power Dissipation @ T = 25°C (Note 1)  
A
Drain  
Operating and Storage Temperature Range  
Single Pulse Drain−to−Source Avalanche  
T , T  
55 to  
+175  
°C  
J
stg  
4
Drain  
E
AS  
454  
mJ  
4
Energy − Starting T = 25°C  
J
2
D PAK  
NTx60N06  
AYWW  
(V = 75 Vdc, V = 10 Vdc, L = 0.3 mH  
DD  
GS  
CASE 418B  
STYLE 2  
I
= 55 A, V = 60 Vdc)  
2
L(pk)  
DS  
Thermal Resistance  
− Junction−to−Case  
°C/W  
°C  
3
R
R
1.0  
62.5  
q
JC  
JA  
2
1
Gate  
3
− Junction−to−Ambient (Note 1)  
q
Drain  
Source  
Maximum Lead Temperature for Soldering  
T
260  
L
Purposes, 1/8from case for 10 seconds  
NTx60N06 = Device Code  
x
A
Y
WW  
= P or B  
= Assembly Location  
= Year  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
= Work Week  
1. When surface mounted to an FR4 board using minimum recommended pad  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
2
size, (Cu Area 0.412 in ).  
dimensions section on page 7 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
October, 2004 − Rev. 3  
NTP60N06/D  
 

NTB60N06 替代型号

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