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NTB60N06G PDF预览

NTB60N06G

更新时间: 2024-11-13 22:28:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
10页 89K
描述
60 V, 60 A, N−Channel TO−220 and D2PAK

NTB60N06G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.19雪崩能效等级(Eas):454 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):60 A
最大漏极电流 (ID):60 A最大漏源导通电阻:0.014 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
最大脉冲漏极电流 (IDM):180 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTB60N06G 数据手册

 浏览型号NTB60N06G的Datasheet PDF文件第2页浏览型号NTB60N06G的Datasheet PDF文件第3页浏览型号NTB60N06G的Datasheet PDF文件第4页浏览型号NTB60N06G的Datasheet PDF文件第5页浏览型号NTB60N06G的Datasheet PDF文件第6页浏览型号NTB60N06G的Datasheet PDF文件第7页 
NTP60N06, NTB60N06  
Power MOSFET  
60 V, 60 A, N−Channel  
TO−220 and D2PAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
60 VOLTS, 60 AMPERES  
Features  
RDS(on) = 14 mW  
Pb−Free Packages are Available  
N−Channel  
D
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAMS  
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
4
Drain−to−Source Voltage  
V
60  
60  
DSS  
DGR  
Drain  
Drain−to−Gate Voltage (R = 10 MW)  
V
GS  
4
Gate−to−Source Voltage  
− Continuous  
V
V
"20  
"30  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
TO−220  
CASE 221A  
STYLE 5  
NTx60N06  
Drain Current  
− Continuous @ T = 25°C  
AYWW  
I
D
60  
42.3  
180  
Adc  
Apk  
A
− Continuous @ T = 100°C  
I
D
A
− Single Pulse (t v10 ms)  
I
DM  
p
1
Gate  
3
1
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
150  
1.0  
2.4  
W
W/°C  
W
2
A
Source  
3
2
Total Power Dissipation @ T = 25°C (Note 1)  
A
Drain  
Operating and Storage Temperature Range  
Single Pulse Drain−to−Source Avalanche  
T , T  
55 to  
+175  
°C  
J
stg  
4
Drain  
E
AS  
454  
mJ  
4
Energy − Starting T = 25°C  
J
2
D PAK  
NTx60N06  
AYWW  
(V = 75 Vdc, V = 10 Vdc, L = 0.3 mH  
DD  
GS  
CASE 418B  
STYLE 2  
I
= 55 A, V = 60 Vdc)  
2
L(pk)  
DS  
Thermal Resistance  
− Junction−to−Case  
°C/W  
°C  
3
R
R
1.0  
62.5  
q
JC  
JA  
2
1
Gate  
3
− Junction−to−Ambient (Note 1)  
q
Drain  
Source  
Maximum Lead Temperature for Soldering  
T
260  
L
Purposes, 1/8from case for 10 seconds  
NTx60N06 = Device Code  
x
A
Y
WW  
= P or B  
= Assembly Location  
= Year  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
= Work Week  
1. When surface mounted to an FR4 board using minimum recommended pad  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
2
size, (Cu Area 0.412 in ).  
dimensions section on page 7 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
October, 2004 − Rev. 3  
NTP60N06/D  
 

NTB60N06G 替代型号

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NVB60N06T4G ONSEMI

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