NE8500100
NE8500199
C-BAND MEDIUM POWER GaAs MESFET
ABSOLUTE MAXIMUM RATINGS1
FEATURES
(TC = 25 °C unless otherwise noted)
• HIGH OUTPUT POWER: 1 W
• HIGH LINEAR GAIN: 9.0 dB
SYMBOLS
VDS
PARAMETERS
Drain to Source Voltage
Gate to Drain Voltage
Gate to Source Voltage
Drain Current
UNITS
V
RATINGS
15
-18
• HIGH EFFICIENCY: 37% (PAE)
• INDUSTRY STANDARD PACKAGING
VGD
V
VGS
V
-12
IDS
A
IDSS
6.0
• THIS DEVICE IS ALSO AVAILABLE AS A
TWO-CELL CHIP: NE8500100
IGS
Gate Current
mA
W
PT
Total Power Dissipation
Channel Temperature
Storage Temperature
6.0
TCH
°C
°C
175
DESCRIPTION
TSTG
-65 to +175
Note:
TheNE8500199isamediumpowerGaAsMESFETdesigned
for up to a 1W output stage or as a driver for higher power
devices. The device has no internal matching and can be
used at frequencies from UHF to 8.5 GHZ. The device is
availableinthe“99”packageorinchipform. Thechipisatwo-
cell die; bonding both cells delivers the rated performance.
1. Operation in excess of any one of these parameters may result in
permanent damage.
RECOMMENDED OPERATING LIMITS
SYMBOLS
PARAMETERS
Drain to Source Voltage
Channel Temperature
Gain Compression
Gate Resistance
UNITS MIN TYP MAX
The NE850 Series Transistors are manufactured to NEC's
stringent quality assurance standards to ensure highest reli-
ability and consistent superior performance.
VDS
V
9
10
130
3.0
4
TCH
°C
dB
KΩ
GCOMP
RG
1
ELECTRICAL CHARACTERISTICS (TC = 25°C)
PART NUMBER
NE8500199
NE8500100
PACKAGE OUTLINE
00 (Chip), 99
SYMBOLS
CHARACTERISTICS
UNITS
MIN
TYP
MAX
TEST CONDITIONS
POUT
Power Out at Fixed Input Power
dBm
dB
28.5
29.5
PIN = 21.0 dBm
GL
ηADD
IDS
Linear Gain
9.0
37
f = 7.2 GHz
VDS = 10 V; IDSQ = 200 mA
RG = 1KΩ
Collector Efficiency
Drain Source Current
Saturated Drain Current
Pinch-off Voltage
Transconductance
Thermal Resistance
%
mA
mA
V
200
IDSS
VP
330
-3.0
825
-1.0
VDS = 2.5 V; VGS = 0 V
VDS = 2.5 V; IDS = 4 mA
VDS = 2.5 V; IDS = IDSS
Channel to Case
gm
mS
°C/W
300
RTH
60
California Eastern Laboratories