ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MRF281/D
The RF Sub–Micron MOSFET Line
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N–Channel Enhancement–Mode Lateral MOSFETs
Designed for digital and analog cellular PCN and PCS base station
applications with frequencies from 1000 to 2500 MHz. Characterized for
operation Class A and Class AB at 26 volts in commercial and industrial
applications.
2000 MHz, 4 W, 26 V
LATERAL N–CHANNEL
BROADBAND
• Specified Two–Tone Performance @ 1930 and 2000 MHz, 26 Volts
Output Power — 4 Watts PEP
Power Gain — 11 dB
Efficiency — 30%
Intermodulation Distortion — –29 dBc
RF POWER MOSFETs
• Capable of Handling 10:1 VSWR, @ 26 Vdc,
2000 MHz, 4 Watts CW Output Power
• Excellent Thermal Stability
• Characterized with Series Equivalent Large–Signal Impedance Parameters
• S–Parameter Characterization at High Bias Levels
CASE 458B–03, STYLE 1
(NI–200S)
• Available in Tape and Reel. R1 Suffix = 500 Units per
12 mm, 7 inch Reel.
(MRF281SR1)
CASE 458C–03, STYLE 1
(NI–200Z)
(MRF281ZR1)
MAXIMUM RATINGS
Rating
Symbol
Value
65
Unit
Vdc
Vdc
Drain–Source Voltage
Gate–Source Voltage
V
DSS
V
GS
20
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
20
0.115
Watts
W/°C
C
Storage Temperature Range
Operating Junction Temperature
T
–65 to +150
200
°C
°C
stg
T
J
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
Unit
R
5.74
°C/W
θ
JC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
V
65
—
—
74
—
—
—
10
1
Vdc
µAdc
µAdc
(BR)DSS
(V = 0, I = 10 µAdc)
GS
D
Zero Gate Voltage Drain Current
(V = 28 Vdc, V = 0)
I
DSS
DS
GS
Gate–Source Leakage Current
(V = 20 Vdc, V = 0)
I
GSS
GS
DS
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 3
MOTOROLA RF DEVICE DATA
MRF281SR1 MRF281ZR1
1
Motorola, Inc. 2002