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MRF281 PDF预览

MRF281

更新时间: 2024-11-19 22:45:59
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
8页 313K
描述
RF POWER FIELD EFFECT TRANSISTORS

MRF281 数据手册

 浏览型号MRF281的Datasheet PDF文件第2页浏览型号MRF281的Datasheet PDF文件第3页浏览型号MRF281的Datasheet PDF文件第4页浏览型号MRF281的Datasheet PDF文件第5页浏览型号MRF281的Datasheet PDF文件第6页浏览型号MRF281的Datasheet PDF文件第7页 
ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF281/D  
The RF Sub–Micron MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
ꢒꢀ ꢁ ꢖꢗꢘꢙꢀ ꢘ  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for digital and analog cellular PCN and PCS base station  
applications with frequencies from 1000 to 2500 MHz. Characterized for  
operation Class A and Class AB at 26 volts in commercial and industrial  
applications.  
2000 MHz, 4 W, 26 V  
LATERAL N–CHANNEL  
BROADBAND  
Specified Two–Tone Performance @ 1930 and 2000 MHz, 26 Volts  
Output Power — 4 Watts PEP  
Power Gain — 11 dB  
Efficiency — 30%  
Intermodulation Distortion — –29 dBc  
RF POWER MOSFETs  
Capable of Handling 10:1 VSWR, @ 26 Vdc,  
2000 MHz, 4 Watts CW Output Power  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
S–Parameter Characterization at High Bias Levels  
CASE 458B–03, STYLE 1  
(NI–200S)  
Available in Tape and Reel. R1 Suffix = 500 Units per  
12 mm, 7 inch Reel.  
(MRF281SR1)  
CASE 458C–03, STYLE 1  
(NI–200Z)  
(MRF281ZR1)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
20  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
20  
0.115  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
5.74  
°C/W  
θ
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
V
65  
74  
10  
1
Vdc  
µAdc  
µAdc  
(BR)DSS  
(V = 0, I = 10 µAdc)  
GS  
D
Zero Gate Voltage Drain Current  
(V = 28 Vdc, V = 0)  
I
DSS  
DS  
GS  
Gate–Source Leakage Current  
(V = 20 Vdc, V = 0)  
I
GSS  
GS  
DS  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 3  
Motorola, Inc. 2002  

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