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MRF282 PDF预览

MRF282

更新时间: 2024-11-20 05:50:11
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体晶体管功率场效应晶体管射频
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12页 299K
描述
RF Power Field Effect Transistors

MRF282 数据手册

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Document Number: MRF282  
Rev. 15, 5/2006  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
MRF282SR1  
MRF282ZR1  
N-Channel Enhancement-Mode Lateral MOSFETs  
Designed for Class A and Class AB PCN and PCS base station applications  
with frequencies up to 2600 MHz. Suitable for FM, TDMA, CDMA, and  
multicarrier amplifier applications.  
Specified Two-Tone Performance @ 2000 MHz, 26 Volts  
Output Power — 10 Watts PEP  
Power Gain — 10.5 dB  
2000 MHz, 10 W, 26 V  
LATERAL N-CHANNEL  
BROADBAND  
Efficiency — 28%  
Intermodulation Distortion — -31 dBc  
RF POWER MOSFETs  
Specified Single-Tone Performance @ 2000 MHz, 26 Volts  
Output Power — 10 Watts CW  
Power Gain — 9.5 dB  
Efficiency — 35%  
Capable of Handling 10:1 VSWR, @ 26 Vdc,  
2000 MHz, 10 Watts CW Output Power  
Features  
CASE 458B-03, STYLE 1  
NI-200S  
Excellent Thermal Stability  
Characterized with Series Equivalent Large-Signal  
MRF282SR1  
Impedance Parameters  
RoHS Compliant  
Available in Tape and Reel. R1 Suffix = 500 Units per 12 mm, 7 inch Reel.  
CASE 458C-03, STYLE 1  
NI-200Z  
MRF282ZR1  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
-0.5, +65  
20  
Unit  
Vdc  
Vdc  
Drain-Source Voltage  
Gate-Source Voltage  
V
DSS  
V
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
60  
0.34  
W
W/°C  
C
D
Storage Temperature Range  
Case Operating Temperature  
Operating Junction Temperature  
T
- 65 to +150  
150  
°C  
°C  
°C  
stg  
T
C
T
200  
J
Table 2. Thermal Characteristics  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
JC  
4.2  
°C/W  
Table 3. Electrical Characteristics (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Off Characteristics  
Drain-Source Breakdown Voltage  
(V = 0, I = 10 μAdc)  
V
65  
Vdc  
μAdc  
μAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 28 Vdc, V = 0)  
I
1.0  
1.0  
DSS  
DS  
GS  
Gate-Source Leakage Current  
(V = 20 Vdc, V = 0)  
I
GSS  
GS  
DS  
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
© Freescale Semiconductor, Inc., 2006. All rights reserved.  

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