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MRF284SR1 PDF预览

MRF284SR1

更新时间: 2024-11-20 14:43:43
品牌 Logo 应用领域
恩智浦 - NXP 放大器晶体管
页数 文件大小 规格书
12页 420K
描述
S BAND, Si, N-CHANNEL, RF POWER, MOSFET, CASE 360C-05, 3 PIN

MRF284SR1 技术参数

生命周期:Obsolete包装说明:CASE 360C-05, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.75
风险等级:5.05外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:65 V
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:S BAND
JESD-30 代码:R-CDFP-F2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:200 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:FLATPACK
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF284SR1 数据手册

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ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF284/D  
The RF Sub–Micron MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for PCN and PCS base station applications with frequencies from  
1000 to 2600 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier  
applications. To be used in Class A and Class AB for PCN–PCS/cellular radio  
and wireless local loop.  
2000 MHz, 30 W, 26 V  
LATERAL N–CHANNEL  
BROADBAND  
Specified Two–Tone Performance @ 2000 MHz, 26 Volts  
Output Power = 30 Watts PEP  
Power Gain = 9 dB  
RF POWER MOSFETs  
Efficiency = 30%  
Intermodulation Distortion = –29 dBc  
Typical Single–Tone Performance at 2000 MHz, 26 Volts  
Output Power = 30 Watts CW  
Power Gain = 9.5 dB  
Efficiency = 45%  
CASE 360B–05, STYLE 1  
NI–360  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 2000 MHz, 30 Watts CW  
Output Power  
MRF284R1  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
In Tape and Reel. R1 Suffix = 500 Units per 32 mm, 13 inch Reel.  
CASE 360C–05, STYLE 1  
NI–360S  
MRF284SR1  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
20  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
87.5  
0.5  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
2.0  
°C/W  
θ
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
V
65  
1.0  
10  
Vdc  
µAdc  
µAdc  
(BR)DSS  
(V = 0, I = 10 µAdc)  
GS  
D
Zero Gate Voltage Drain Current  
(V = 20 Vdc, V = 0)  
I
DSS  
DS  
GS  
Gate–Source Leakage Current  
(V = 20 Vdc, V = 0)  
I
GSS  
GS  
DS  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 11  
Motorola, Inc. 2002  

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